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Featured

Corporate News

Cadence at the TSMC OIP: Pioneering the Future of Semiconductor Design

The semiconductor industry stands at a pivotal moment. As we push toward more advanced…

Corporate
Corporate 20 Sep 2025 • 3 min read
OIP , featured , 3D-IC , 3DIC , TSMC

Corporate News

Building a Future Beyond Boundaries with Honda and Cadence

We at Cadence are proud to be a long-term partner of Honda R&D (HGRX), and our collaboration…

Corporate
Corporate 17 Sep 2025 • 6 min read
Automotive , featured , physical ai , automotive electronics , AI

Corporate News

CadenceLIVE India 2025 Recap – Where Inspiration Meets Innovation

On August 13, 2025, CadenceLIVE India 2025 set the stage for a remarkable convergence…

Reela Samuel
Reela Samuel 2 Sep 2025 • 2 min read
featured , cadence , AI-Driven Design , cadencelive , AI

Analog/Custom Design

Virtuoso Studio IC25.1 ISR1 Now Available

Virtuoso Studio IC25.1 ISR1 production release is now available for download.

Virtuoso Release Team
Virtuoso Release Team 27 Aug 2025 • 1 min read
IC25.1 , featured , Cadence blogs , Virtuoso Studio , IC Release Blog Announcement
cdns - all_blogs_categories

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Blog - Post List

Latest blogs

Analog/Custom Design

Virtuosity: 10 Things I Learned in December By Browsing Cadence Online Support

In addition to the R&D engineers who actually develop our software, the folks in…

stacyw 14 Jan 2013 • 4 min read
Variability Aware Design , AMS , Analog Design Environment , Virtuoso IC6.1.5 , Virtuoso Space-based Router , VSR , Analog Simulation , Cadence Space-based Router , workshop , IC615 , IC 6.1.5 , ADE , Mixed-Signal , Virtuoso Analog Design Environment , Virtuoso , ADE-GXL , Analog Design Environment , Schematic Editor , ViVA , ADE-XL , mixed signal , Custom IC Design , Virtuoso Layout Suite

Analog/Custom Design

Library "Safe Margins" -- Are They Really Saving Your Design?

Designers need to radically re-think their strategies for timing closure to get the…

AElzeftawi 10 Jan 2013 • 4 min read
Standard Cell , memory characterization , Process Variation , Elzeftaki , library characterization , Timing Closure , Complex IO , PVT corners , safe margins , Complex Cell

Analog/Custom Design

SKILL for the Skilled: Part 6, Many Ways to Sum a List

In a previous post I presented sumlist_2b as a function that would sum lists of length…

Team SKILL 10 Jan 2013 • 5 min read
Team SKILL , programming , Jim Newton , sum a list , IC615 , SKILL for the Skilled , summing , Lisp , SKILL++ , SKILL

System, PCB, & Package Design 

Customer Support Recommended – Pin Swapping in Allegro Design Entry CIS and PCB …

Placement and routing have always been an integral part of printed circuit board…

Naveen 9 Jan 2013 • 4 min read
capture , "capture CIS" , SPB16.3 , Allegro Design Entry , Allegro 16.6 , customer support , PCB design" , net swap , Design Entry CIS , OrCAD Capture Marketplace , Routing , OrCAD Capture , 16.6 , Allegro 16.3 , SPB 16.3 , Capture CIS , Capture-CIS , Allegro 16.5 , Allegro 16.2 , SPB16.2 , Appnote , pinswap , "PCB design" , OrCAD , swap , 16.5 , Design Entry , SPB16.5 , Allegro PCB Editor , pin swap , application note , OrCAD PCB Editor , library , PCB Capture , Schematic

Analog/Custom Design

Revamped Mixed-Signal Solutions Portal Reflects Cadence Leadership and Commitmen…

Cadence holds a leading position in the EDA industry due to its broad product portfolio…

Sathish Bala 8 Jan 2013 • 1 min read
CDNLive , cadence , AMS Designer , custom , Design Challenges , analog , web page , Mixed-Signal Methodology Guide , Mixed-Signal , Mixed-signal solutions web page , Virtuoso , mixed-signal book , digital , implementation , mixed signal , Encounter Digital Platform , web site , verification

Verification

Specman: Determining a Good Value for optimal_process_size

Specman's Automatic GC Settings mechanism is aimed at eliminating the need for users…

teamspecman 1 Jan 2013 • 7 min read
AF , memory usage , optimal_process_size , Specman , garbage collection , Functional Verification' signal integrity , e language , optimal process size , memory consumption , OPS

Verification

System Design 2012 – Real Users Achieving Real Results!

This morning the final success story my team has been working on for this year went…

fschirrmeister 21 Dec 2012 • 4 min read
ESL Market , Nufront , Altair , FPGA Based Prototyping , Verification Computing Platform , Virtual System Platform , cadence , Sigma , Acceleration , Functional Verification , LeCroy , Dynamic Power Analysis , Doulog , System Design and Verification , Freescale , Methods2Business , System Development Suite , Samsung , embedded software , Rohde & Schwarz , Ericsson , LSI , Palladium XP , Emulation , CSR , CDNLive! , ST Microelectronics , Texas Instruments , xilinx , DAC 2012 , ARM , Schirrmeister , Accelerated Verification IP , low power optimization

RF Engineering

Simulating Crystal Oscillators is Much Easier in MMSIM12.1 - Part 2

Greetings, Simulating crystal oscillators got a lot easier in MMSIM12.1... We…

Tawna 20 Dec 2012 • 5 min read
RF , RF Simulation , analog/RF , APS , Circuit simulation , Virtuoso Spectre , HB , Spectre RF , Analog Simulation , MMSIM , Virtuoso Spectre Simulator GXL , MMSIM 12.1 , analog , Analysis , ADE , Virtuoso Spectre Simulator XL , spectreRF , Spectre , RF design , Circuit Design , VCO , crystal oscillator , Oscillator , simulation

System, PCB, & Package Design 

Be Among the First IC Packagers to Experience the New GDS-II Stream Interface in…

For most IC package designers, the GDSII format is a part of daily life. You may…

Jeff Gallagher 20 Dec 2012 • 5 min read
SiP , IC Package , IC Packaging , GDSII , packaging , cadence , Digital SiP design , stream , 16.6 , GDS-II , IC Packaging and SiP , APD , IC Packaging & SiP design , Allegro Package Designer , APD 16.6 , SiP Layout , Physical layout and co-design

RF Engineering

Simulating Crystal Oscillators is Much Easier in MMSIM12.1 - Part 1

Greetings! Simulating Crystal Oscillators got a lot easier in MMSIM12.1... We…

Tawna 19 Dec 2012 • 8 min read
RF , RF Simulation , analog/RF , 12.1 , HB , Spectre RF , ADE-L , Analog Simulation , MMSIM , MMSIM 12.1 , analog , RF spectre spectreRF , Virtuoso Spectre Simulator XL , spectreRF , RF design , Circuit Design , harmonic balance , VCO , crystal oscillator , Oscillator

Verification

University of Aizu and Cadence Collaborate to Deliver a Course Featuring High-Level…

Today we issued a Japan-only press release announcing a high-level synthesis joint…

Jack Erickson 17 Dec 2012 • 2 min read
High-Level Synthesis , university , TLM-driven design , TLM , japan , SystemC , C-to-Silicon Compiler , DAC 2012 , Aizu , C++

Verification

C-to-Silicon 12.2 Available for Your Holiday Shopping List

The winter holiday season is that special time of year when we get bombarded with…

Jack Erickson 13 Dec 2012 • 4 min read
High-Level Synthesis , Flex Channels , C-to-Silicon 12.2 , Jack Erickson , IP re-use , rtl compiler , SystemC , C-to-Silicon Compiler , HLS , clock gating , QoR , System Design and Verification

Analog/Custom Design

Mixed Signal Technology Summit Proceedings Now Available

In September 2012, Cadence held its second Mixed-Signal Summit in San Jose, California…

nizic 13 Dec 2012 • 5 min read
Static timing analysis , mixed-signal seminars , AMS , static analysis , EDI , microcontrollers , ARM Cortex M0 , mixed signal design , cadence , Functional Verification , mixed signal methodology , mixed signal solution , Open Access , STA , Verilog-AMS , timing model , FTM , Mixed-Signal , MCUs , encounter , Mixed-Signal Technology Summit , analog behavoral , analog behavioral models , analog/mixed-signal , mixed signal physical implementation open access , model validation , Signal Integrity , Virtuoso , Spectre , Cortex-M0 , oa , RNM , mixed signal methodology guide , real number types , Mixed signal physical implementation , behavioral models , mixed signal , OA: OpenAccess , cortex M , mixed-signal design , wreal , real number models , ARM , ARM-Cortex-M , OpenAccess , SPICE , mixed signal implementation , liberty model , simulation , AMS Verification

Verification

Securing the Internet of Things

While I had looked at the challenges of hardware/software integration in various…

fschirrmeister 12 Dec 2012 • 3 min read
security , Intel , device security , hackers , System Development Suite , Amphion Forum , embedded software , Green Hills , burning printer , Mocana , software security , cyber attacks , Internet of Things , phone emissions , Schirrmeister , HW/SW Co-Development

System, PCB, & Package Design 

What's Good About RF PCB and Layout? 16.6 Has Many New Enhancements!

The 16.6 Allegro RF PCB application has many new enhancements. I’ll cover a few over…

Jerry GenPart 11 Dec 2012 • 3 min read
PCB , PCB Layout and routing , RF , Allegro 16.6 , RF PCB , Routing , 16.6 routing , PCB Editor , Layout , design , "PCB design" , PCB design , Grzenia , Allegro PCB Editor , Allegro

Verification

Avoid Overly Long Expressions in Specman e Code

When you write your e code, a good practice is to avoid expressions that are "overly…

teamspecman 11 Dec 2012 • 3 min read
AF , parsing , Specman , Functional Verification , long expressions , e code , e language

Digital Design

SPICE Correlation Made Easy by Encounter Timing System (ETS)

Hello, and welcome to my first blog! As an application engineer in customer support…

MJ Cad 10 Dec 2012 • 4 min read
app note , Static timing analysis , ets , mukesh , STA , spice correlation , Spectre , signoff , ETS create_spice_deck , Encounter Timing System , SPICE

Verification

Update to the Linux Kernel Message System

A few months ago I wrote an Introduction to the Linux Kernel Message System . As…

jasona 7 Dec 2012 • 1 min read
Virtual System Platform , virtual platforms , GDB , VAP , cadence , ring buffer , uncompressing Linux , virtual prototypes , System Design and Verification , kernel message system , booting Linux , embedded software , VSP , Imperas , software development , Zynq virtual platform , linux , Zynq-7000 , Embedded Linux , ESL , kernel messaging system , Andrews

System, PCB, & Package Design 

Leverage System Planning to Maximize Performance of Silicon Interposer

Recently, an article was published in Chip Scale Review by Cadence product manager…

TeamAllegro 6 Dec 2012 • 2 min read
SI , PI , Chip Scale Review , SiP , IC Packaging , Team Allegro , 3D IC , Kevin Rinebold , 3D-IC , Power Integrity , TSV , silicon interposer , Signal Integrity , 2.5D IC , system planning , system co-analysis , 2.5D
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