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Latest Blog Posts

  • Analog and Digital IC Design Flows: The Past, Present, and Future of Electronics

    Learning and Support: Analog and Digital IC Design Flows: The Past, Present, and Future of Electronics

    P Saisrinivas
    P Saisrinivas
    Curious to see how your IC design skills (Analog/Digital) stack up—or where to level up next? Dive in and discover your roadmap to becoming an IC design pro in this blog - This blog post dives into the distinct design flows of Analog and Digital Integrated Circuits (ICs), outlining the key stages and tools used in each stage in detail. Whether you're working on transistor-level designs, block-level designs, and SoC-level…
    • 16 Jun 2025
  • Elevate Your EDA Skills: Achieve Unmatched PPA with Genus Synthesis Solution

    Digital Design: Elevate Your EDA Skills: Achieve Unmatched PPA with Genus Synthesis Solution

    Neha Joshi
    Neha Joshi

    As the electronic design automation (EDA) landscape continues to evolve, the importance of efficient and effective synthesis has grown exponentially. With the increasing complexity of modern system-on-chips (SoCs), design teams face significant challenges in achieving optimal power, performance, and area (PPA) results. In this context, the Cadence Genus Synthesis Solution has emerged as a game-changer, helping designers…

    • 16 Jun 2025
  • Discover Cadence Community Forums Resources for Tcl Scripting

    System, PCB, & Package Design : Discover Cadence Community Forums Resources for Tcl Scripting

    Renu Vibha
    Renu Vibha
    In the world of PCB design and IC packaging, automation is key to enhancing productivity and ensuring precision. Allegro X tools from Cadence offer extensive scripting capabilities through Tcl (Tool Command Language). This blog post guides you throug...
    • 12 Jun 2025
  • Cadence and PCI Express 7.0

    Corporate News: Driving the Future of High-Speed Computing with PCIe 7.0 Innovation

    Corporate
    Corporate
    Escalating compute processing demands from generative and agentic AI applications have spurred a massive AI infrastructure buildout, and the need for faster and more efficient data transfer capabilities has never been greater. Protocol standards and...
    • 11 Jun 2025
  • Introducing Cadence Cerebrus AI Studio

    Digital Design: Transforming Chip Design with Cadence Cerebrus AI Studio

    Sean Kobayashi
    Sean Kobayashi

    Cadence Cerebrus AI Studio

    Cadence is transforming chip design with the launch of Cadence Cerebrus® AI Studio, the industry's first agentic AI, multi-block, multi-user design platform. This cutting-edge solution accelerates system-on-chip (SoC) design by 5 – 10X while achieving unparalleled power, performance, and area (PPA) gains. Built to empower engineers with intelligent workflows and advanced data analytics, Cadence Cerebrus AI Studio…

    • 11 Jun 2025
  • ケイデンスのエージェント型AIがSoC/システム・エンジニアリングの時間を数ヶ月短縮

    Cadence Japan: ケイデンスのエージェント型AIがSoC/システム・エンジニアリングの時間を数ヶ月短縮

    Cadence Japan
    Cadence Japan
    最新のSoC設計の複雑さに対応するにあたり、AIを活用したチップ設計は必要不可欠となっています。設計に活用するエージェント型AIの段階、ケイデンスの関連製品などについては、こちらをご覧ください。
    • 5 Jun 2025
  • Time-of-Flight Decoding with Tensilica Vision DSPs - AI's Role in ToF Decoding

    SoC and IP: Time-of-Flight Decoding with Tensilica Vision DSPs - AI's Role in ToF Decoding

    SriramK
    SriramK

    In our previous blog, we discussed the fundamentals of time-of-flight (ToF) technology, including the signal processing requirements for pre-processing and decoding ToF sensor data. We also examined how Tensilica Vision DSPs meet the computational demands while ensuring energy efficiency. In case you missed it, here's the link to the previous post.

    Building on that, today we will examine how artificial intelligence…

    • 5 Jun 2025
  • Insights from the Verification Software Track at CadenceLIVE Silicon Valley 2025

    Verification: Insights from the Verification Software Track at CadenceLIVE Silicon Valley 2025

    RobbieOSullivan
    RobbieOSullivan
    Earlier this month, I had the opportunity to attend CadenceLIVE Silicon Valley 2025, a premier event that brings together semiconductor and systems innovators to share how they are leveraging Cadence tools to drive design excellence. Among the m...
    • 5 Jun 2025
  • Cadence Giving Foundation Awards 25 First-Generation Scholarships

    Life at Cadence: Cadence Giving Foundation Awards 25 First-Generation Scholarships

    Ryan Robello
    Ryan Robello
    Congratulations to the recipients of the 2025-2026 Cadence First-Generation Student Scholarship! As we look toward the future of innovation and the technology industry, it's essential for the next generation to be ready to contribute to an ever-...
    • 4 Jun 2025
  • Cadence Training at CadenceLIVE Silicon Valley 2025

    Learning and Support: Cadence Training at CadenceLIVE Silicon Valley 2025

    ErinGrant
    ErinGrant
    CadenceLIVE Silicon Valley 2025, recently held at the Santa Clara Convention Center, brought together industry leaders, technologists, and innovators to explore the future of electronic design and intelligent systems. The event showcased groundbreaki...
    • 4 Jun 2025
  • Arm Zena CSS – Accelerating Chiplet-Based SoC Design for AI-Defined Vehicles

    SoC and IP: Arm Zena CSS – Accelerating Chiplet-Based SoC Design for AI-Defined Vehicles

    Robert
    Robert

    Cadence is collaborating with Arm on their groundbreaking first-generation compute subsystems (CSS) for automotive, Arm® Zena™ CSS. This partnership marks a significant milestone in the automotive industry, enabling the realization of software-defined vehicles (SDVs) as they incorporate more AI-defined features to meet driver demands. Leveraging Zena CSS, combined with Cadence’s automotive chiplet and IP solutions…

    • 4 Jun 2025
  • Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems

    Corporate News: Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems

    Corporate
    Corporate
    Design solution enables early software development, SoC design, and chiplet interoperability for software-defined vehicles Cadence today announced IP, design solution, and expert design services for software and Systems-on-Chip (SoCs) based on Arm&r...
    • 4 Jun 2025
  • Getting Started with CAE Software for FEA

    Physical Systems Simulation (CAE): Getting Started with CAE Software for FEA

    Cadence MSC Software
    Cadence MSC Software
    This page was originally published as a part of Hexagon's Design and Engineering blog. Hexagon Design and Engineering is now a part of Cadence. Creating, better, safer and more ambitious designs require simulation and analysis tools that help yo...
    • 3 Jun 2025
  • Accelerating RFIC EM Analysis with EMX Planar 3D Solver in Virtuoso HI Platform

    Analog/Custom Design: Accelerating RFIC EM Analysis with EMX Planar 3D Solver in Virtuoso HI Platform

    Pratul Nijhawan
    Pratul Nijhawan

    In modern IC design, especially with the rise of heterogeneous integration, electromagnetic (EM) analysis is critical for ensuring signal integrity, performance, and reliability. Cadence’s Virtuoso Heterogeneous Integration (Virtuoso HI) platform, combined with the EMX Planar 3D Solver, offers a powerful, layout-aware EM simulation environment directly within the Virtuoso design flow—so you can analyze, optimize…

    • 3 Jun 2025
  • The Power of Clarity in Microwave Office: Transforming 3D EM Simulation

    Analog/Custom Design: The Power of Clarity in Microwave Office: Transforming 3D EM Simulation

    Sanjeev Kumar
    Sanjeev Kumar

    In today’s high-frequency, high-density design landscape, engineers face a growing challenge: accurately simulating real-world electromagnetic behavior in increasingly complex systems. The answer? Clarity 3D Solver, seamlessly integrated into Cadence AWR Microwave Office.

    This powerful combination is redefining how RF and microwave engineers approach 3D EM simulation, making it faster, smarter, and more scalable…

    • 3 Jun 2025
  • How Additive Manufacturing Fits into Existing Reverse Engineering Processes

    Physical Systems Simulation (CAE): How Additive Manufacturing Fits into Existing Reverse Engineering Processes

    Cadence MSC Software
    Cadence MSC Software
    This page was originally published as a part of Hexagon's Design and Engineering blog. Hexagon Design and Engineering is now a part of Cadence. Additive manufacturing is a class of technologies that automatically construct 3D physical models fro...
    • 2 Jun 2025
  • Learn PCB Design fundamentals with Cadence

    System, PCB, & Package Design : BoardSurfers: Training Insights: Become a PCB Design Expert with a New Course

    AsadMakandar
    AsadMakandar
    Are you ready to supercharge your career in printed circuit board (PCB) design and manufacturing? We are pleased to present a comprehensive PCB Design Fundamentals course, which is now available at Cadence Training. This exciting course is ...
    • 1 Jun 2025
  • The Fascinating Design Challenges of Contact Lenses

    Physical Systems Simulation (CAE): The Fascinating Design Challenges of Contact Lenses

    Cadence MSC Software
    Cadence MSC Software
    This page was originally published as a part of Hexagon's Design and Engineering blog. Hexagon Design and Engineering is now a part of Cadence. Contact lenses are one of the most common medical prostheses. They are so common that we don’t ...
    • 30 May 2025
  • Conformal AI Studio前端驗證設計挑戰迎刃而解

    Spotlight Taiwan: Conformal AI Studio前端驗證設計挑戰迎刃而解

    candyyu
    candyyu
    Cadence Conformal 技術研討會圓滿落幕 Cadence於四月新竹圓滿舉辦Cadence Conformal 前端驗證技術研討會,該活動重點介紹最新的前端驗證設計的最新方案Conformal AI Studio,該方案專為解決日益複雜的前端設計挑戰而打造,旨在提升設計人員的工作效率,進而優化全流程功耗、效能和面積 (PPA)等設計目標。Conformal 技術在邏輯等效驗證(LEC)領域深耕數十年,長期以來已成為驗證Cadence與第三方數位設計工具正確性的關鍵...
    • 28 May 2025
  • Changing Electronic Design with AI-Driven OnCloud Agent and Hybrid Cloud

    Corporate News: Changing Electronic Design with AI-Driven OnCloud Agent and Hybrid Cloud

    Corporate
    Corporate
    Cadence has announced the integration of the OnCloud agent into its Cadence OnCloud platform, introducing natural language processing for user interaction with the cloud console portal. This innovative, AI-driven feature provides interactive support,...
    • 28 May 2025
  • Cadence and SkyWater: Fostering the Next Generation of Innovators

    Academic Network: Cadence and SkyWater: Fostering the Next Generation of Innovators

    Kira Jones
    Kira Jones
    At Cadence, we are passionate about fostering the next generation of innovators. Our commitment to education and innovation is unwavering, and we believe in removing barriers to commercial-grade tools and resources necessary for students and academia...
    • 26 May 2025
  • Empowering the Engineers of Tomorrow: Q&A with Alex Reichanadter

    Physical Systems Simulation (CAE): Empowering the Engineers of Tomorrow: Q&A with Alex Reichanadter

    Cadence MSC Software
    Cadence MSC Software
    This page was originally published as a part of Hexagon's Design and Engineering blog. Hexagon Design and Engineering is now a part of Cadence. When we say students are the engineers of tomorrow, there is a double meaning. The students of today ...
    • 25 May 2025
  • How Nature Is Pushing the Boundaries of Additive Manufacturing

    Physical Systems Simulation (CAE): How Nature Is Pushing the Boundaries of Additive Manufacturing

    Cadence MSC Software
    Cadence MSC Software
    This page was originally published as a part of Hexagon's Design and Engineering blog. Hexagon Design and Engineering is now a part of Cadence. If you thought the origins of additive manufacturing were fairly recent, think again. In 1974, the or...
    • 25 May 2025
  • How Cadence Is Energizing Sustainable Semiconductor Design

    Corporate News: How Cadence Is Energizing Sustainable Semiconductor Design

    Corporate
    Corporate
    The demand for semiconductors is surging due to AI growth, data centers, and digital transformation, but the environmental cost is significant. Energy-intensive manufacturing and waste generation pose challenges that must be addressed for long-term s...
    • 20 May 2025
  • Enhancing Edge AI with the Newest Class of Processor: Tensilica NeuroEdge 130 AICP

    SoC and IP: Enhancing Edge AI with the Newest Class of Processor: Tensilica NeuroEdge 130 AICP

    SriramK
    SriramK

    Artificial intelligence is rapidly expanding its reach into embedded systems and edge devices, driving the need for specialized processors that can efficiently handle complex AI workloads. While Neural Processing Units (NPUs) excel at accelerating neural network computations, the increasing demands of agentic and physical AI networks require a more comprehensive approach. This is where the Cadence Tensilica NeuroEdge…

    • 19 May 2025
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