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Data Center

Cadence Accelerates Digital Twin–Driven Data Center AI Modernization with HPE

Solution will maximize data center and AI factory profitability while delivering…

Corporate
• 3 min read
news story , featured , infrastructure ai , data center , hpe

Corporate News

Honda + Cadence = Physical AI (part 1): What Does “Physical AI” Really Mean?

Hello everyone, I'm Atsushi Ogawa, Center Head of HGR. The more widely the term …

Corporate
• 7 min read
featured , physical ai , HGR , AI , Honda

Corporate News

Design for AI and AI for Design

The semiconductor industry is experiencing a once-in-a-generation transformation…

Corporate
• 6 min read
Allegro X AI , featured , infrastructure ai , agentic ai , Integrity 3D-IC Platform

Digital Design

Cadence Welcomes Ausdia and TimeVision Timing Constraints Management Solution

We're delighted to welcome Ausdia to Cadence. Effective April 16, 2026, Ausdia's…

Corporate
• 2 min read
digital design , Digital Design and Signoff , featured , Tempus timing solution , Timing analysis
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Blog - Post List
Latest blogs

SoC and IP

Storage Analyst Jim Handy says “NAND Cache is Back!”

Storage analyst and Grand Poobah Jim Handy has just released a free White Paper titled…

• 2 min read

SoC and IP

Kingston shows HyperX USB 3.0 SSD prototype at Computex

Earlier, this blog reported on OCZ’s Enyo USB 3.0 SSD and now at a private event…

• 1 min read

Verification

Making an EDA360 System Realization Investment Through Standards Support

Cadence is a sponsor of the Open SystemC Initiative (OSCI) standards organization…

• less than a min read
TLM , C-to-Silcon , OSCI , ESL

SoC and IP

Introduced at Computex: OCZ’s speedy RevoDrive brings PCIe SSD to consumer-class…

PC add-on vendor OCZ plays in several high-performance PC component markets including…

• 1 min read

Verification

C-to-Silicon Compiler 10.1 - Ease Of Use And RTL QoR

In the continuing effort to make high-level synthesis more viable to mainstream RTL…

• 1 min read
CTOS , TLM , C-to-Silicon , Synthesis , HLS

SoC and IP

Hitachi’s Z HDDs: Will 2.5mm less height make a difference? For SSDs?

Hitachi just shaved 2.5mm off of the top of its 2.5-inch laptop hard drives, producing…

• 1 min read

SoC and IP

More details on and system-design implications of the Hitachi-LG Data Storage HyDrive…

As discussed last week in this blog, Hitachi-LG Data Storage (HLDS)--an OEM vendor…

• 3 min read

System, PCB, & Package Design 

What's Good About AMS Simulator And Cursors? You’ll Need The SPB16.3 Release To See

With the SPB16.3 release of AMS Simulator , several new cursor enhancements are available…

• 1 min read
AMS , AMS simulator , SPB 16.3 , PSPICE , SPB , AMS simulation , Schematic

SoC and IP

ST Microelectronics’ SPEAr1300 embedded MCU features 600MHz dual-core ARM Cortex…

A few days ago, this blog discussed the “big resistor” model of SDRAM power consumption…

• 2 min read

Verification

TLM 2.0 As Part Of The EDA360 Vision

Ann Steffora Mutschler recently covered in her blog the progress the industry has…

• 1 min read
TLM , virtual platform , TLM 2.0 , EDA360 , virtual prototype , SystemC , Synthesis , System Design and Verification

System, PCB, & Package Design 

Catch A Full-Wave Summer Kickoff Webinar: CST 3D Extraction Integrated With Cadence…

Is there anyone who does not carry a mobile communication device anymore? Sending…

• 1 min read
SPB16.3 , SiP , Analog and RF SiP design , Digital SiP design , Allegro 16.3 , APD , webinar , SI analysis and modeling

SoC and IP

How does a hybrid SSD/optical drive make sense?

Some combinations like chocolate with peanut butter, ice cream with peanuts and chocolate…

• 1 min read

Verification

EDA360 Is More Than Design IP Plus Software Drivers

I checked my Linked-In messages the other day and saw a survey by Girish Patil with…

• 2 min read
IP , Functional Verification , Virtual Chips , Phoenix , inSilicon , VIP , EDA360 , Sand

SoC and IP

Does Samsung really scare Japan? EETimes’ Junko Yoshida thinks so.

EETimes' Junko Yoshida just published an article titled “5 reasons why Samsung scares…

• 1 min read

SoC and IP

Marc Greenberg’s “big resistor” model of semiconductor DRAM power consumption

Too many DRAM choices. If you want low power DRAM, do you choose LPDDR1, LPDDR2,…

• 2 min read

SoC and IP

OCZ Enyo USB 3.0 SSD reviewed by PC Perspective video

Earlier, we covered the announcement of OCZ’s Enyo USB 3.0 external SSD. Now PC Perspective…

• less than a min read

SoC and IP

InfoWeek video series chronicles storage and SSD Evolution. Part 1 runs 8 minutes…

Can you spare nine minutes to get a really good grounding in SSD concepts? No? How…

• 1 min read

System, PCB, & Package Design 

What's Good About Browsing For Power Pins in Capture? It's In SPB16.3!

The SPB16.3 release of Allegro Design Entry CIS (Capture) now allows you to browse…

• 1 min read
"capture CIS" , Capture CIS' , Design Entry CIS , OrCAD Capture , SPB 16.3 , Capture CIS , Capture-CIS , OrCAD , Design Entry , Schematic

SoC and IP

Squeeze bandwidth inefficiencies out of DDR DRAMs in memory subsystem designs

This blog starts with a simple, sad truth: DDR DRAMs are naturally inefficient. If…

• 6 min read
CDNS - Fix Layout Hompage