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Latest Blog Posts

  • Cadence to Power the Fourth Industrial Revolution in Collaboration with NVIDIA

    Corporate News: Cadence to Power the Fourth Industrial Revolution in Collaboration with NVIDIA

    Tanushri Shah
    Tanushri Shah
    The convergence of artificial intelligence (AI), robotics, and the internet of things (IoT) has brought about the fourth industrial revolution. It's reshaping how we design, manufacture, and interact with the world. At the heart of this era lies ...
    • 25 Apr 2025
  • Cadence San Jose Hosts JEDEC LPDDR Task Group Meeting

    SoC and IP: Cadence San Jose Hosts JEDEC LPDDR Task Group Meeting

    Shyam Sharma
    Shyam Sharma

    Low-power DDR (LPDDR) SDRAM has been one of the most widely used memories in the semiconductor market today. It’s used in a diverse set of applications that spans mobile/handheld devices, IoT, client and server, automotive, Virtual Reality/gaming consoles, robotics, data centers, and AI applications, just to name a few.

    On April 9 and 10, 2025, Cadence San Jose hosted the JEDEC LPDDR Task Group face-to-face meeting…

    • 24 Apr 2025
  • Custom Analog IP Migration in Virtuoso Studio

    Analog/Custom Design: Custom Analog IP Migration in Virtuoso Studio

    ErinGrant
    ErinGrant

    Join Cadence Training and presenters from our CIC experts for this free technical Training Webinar.  
     
    The porting of a custom IP block to a new silicon process has traditionally been a manual process. However, the introduction of new algorithms in Cadence’s Virtuoso Studio, including AI/ML techniques, provides a step change in productivity for design migration.  
     
    This webinar demonstrates three steps for design migration…

    • 23 Apr 2025
  • Efficient Automotive Electronic Component Design and Analysis

    System, PCB, & Package Design : Efficient Automotive Electronic Component Design and Analysis

    MSATeam
    MSATeam

    In the automotive industry, there is zero tolerance for field failures, as human safety is at stake. Given the rapid evolution of the electric vehicle (EV) and autonomous driving technologies, it is critical to accelerate the development of robust designs to remain competitive.

    Simulation of the PCB and IC package components within complex electronic automotive systems plays a pivotal role in ensuring that designs meet…

    • 22 Apr 2025
  • Cadence Microwave Office によるミックスモード・アウトフェージング増幅器の設計

    RF /マイクロ波設計: Cadence Microwave Office によるミックスモード・アウトフェージング増幅器の設計

    RF Design Japan
    RF Design Japan
     近年の通信システムにおいて、基地局増幅器は高周波化・広帯域化が進み、高効率デバイスの開発が進められています。その中で負荷変調を用いた高効率化・広帯域化が注目されています。住友電気工業株式会社では、様々な回路構成の研究に取り組んでおり、将来の増幅器技術の一つであるアウトフェージング増幅器の設計手法が検討されています。アウトフェージング増幅器は、2つの増幅器の出力が互いの負荷インピーダンスを変調し、互いの動作に影響を与えるため、設計が困難です。住友電気工業株式会社は、アウトフェージング増幅器の設計...
    • 22 Apr 2025
  • PCIe NOP Debug Flit as a dedicated Debug Channel

    Verification: NOP Flit Payload: A Dedicated Debug Channel

    Geeta Arora
    Geeta Arora
    Modern PCIe systems are complex, with high-speed data transfer and intricate protocols. Traditional debug methods often struggle to provide the necessary granularity and real-time visibility into link behavior. Transient issues, timing-sensitive erro...
    • 18 Apr 2025
  • Silicon Skylines: Crafting the Future of Electronics

    Digital Design: Silicon Skylines: Crafting the Future of Electronics

    Neha Joshi
    Neha Joshi

    The world of Electronic Design Automation (EDA) is fascinating, where we transform humble grains of sand into sophisticated silicon chips that power our modern lives. Imagine this journey as a grand adventure, akin to building a bustling city from scratch. Buckle up as we take you through the highlights of our latest course, "Introduction to Electronic Design Automation.

    Imagine standing on a beach surrounded by…

    • 17 Apr 2025
  • NepTech – Tackling Marine Decarbonization with Fidelity CFD

    Corporate News: NepTech – Tackling Marine Decarbonization with Fidelity CFD

    Tanushri Shah
    Tanushri Shah
    Maritime transport is the backbone of international trade. It’s responsible for transporting over 80% of global goods, making it critical for commerce and trade. At the same time, it’s the world’s sixth-largest emitter of greenhouse...
    • 17 Apr 2025
  • Cadence and Kyle Juszczyk Partner with Veggielution for Earth Month Event

    Corporate News: Cadence and Kyle Juszczyk Partner with Veggielution for Earth Month Event

    Corporate
    Corporate
    Forty volunteers from Cadence and the San Francisco 49ers participated in farm projects to promote community engagement and climate innovation. In celebration of Earth Month, the Cadence Giving Foundation has partnered with San Francisco 49ers fullba...
    • 16 Apr 2025
  • HBM4 Boosts Memory Performance for AI Training

    SoC and IP: HBM4 Boosts Memory Performance for AI Training

    Frank Ferro
    Frank Ferro

    The recent HBM4 specification announced by JEDEC is great news for developers of AI training hardware. HBM4 is the latest specification in the rapidly evolving High Bandwidth Memory (HBM) DRAM standard, providing 2TB/s of memory performance and higher density up to 64GB (32Gb 16-high), according to JEDEC. "The advancements introduced by HBM4 are vital for applications that require efficient handling of large datasets…

    • 16 Apr 2025
  • Sigrity and Systems Analysis 2024.1 HF2 Release Now Available

    System, PCB, & Package Design : Sigrity and Systems Analysis 2024.1 HF2 Release Now Available

    SigrityReleaseTeam
    SigrityReleaseTeam
    The Sigrity and Systems Analysis (SIGRITY/SYSANLS) 2024.1 HF2 release is now available for download at Cadence Downloads. This blog contains important links for accessing this release and introduces some of the main features that you can look forward to.
    • 16 Apr 2025
  • ケイデンス、業界初のeUSB2V2 IPソリューションを発表

    Cadence Japan: ケイデンス、業界初のeUSB2V2 IPソリューションを発表

    Cadence Japan
    Cadence Japan
    ケイデンスは、業界初のeUSB2V2 IPソリューションを発表しました。詳細はこちらをご覧ください。
    • 16 Apr 2025
  • Multiphysics Analysis Portfolio Continues to Grow

    System, PCB, & Package Design : Multiphysics Analysis Portfolio Continues to Grow

    MSATeam
    MSATeam

    Cadence's multiphysics system analysis (MSA) portfolio grew in both depth and breadth throughout 2024. Across electromagnetics (EM), signal and power integrity (SI/PI), thermal and electronics cooling, computational fluid dynamics (CFD), and data center digital twinning, we offer in-design analysis (IDA) solutions that streamline workflows by integrating multiphysics analyses directly into design platforms for electronic…

    • 15 Apr 2025
  • The Cost Dynamics of Digital Prototyping in the Automotive Industry

    Physical Systems Simulation (CAE): The Cost Dynamics of Digital Prototyping in the Automotive Industry

    Cadence MSC Software
    Cadence MSC Software
    This page was originally published as a part of Hexagon's Design and Engineering blog. Hexagon Design and Engineering is now a part of Cadence. Taking a zero prototyping approach to automotive manufacturing can result in huge benefits for an organis...
    • 15 Apr 2025
  • CadenceLIVE  Silicon Valley 2025: Transforming Tomorrow, Today

    Corporate News: CadenceLIVE Silicon Valley 2025: Transforming Tomorrow, Today

    Corporate
    Corporate
    Are you ready to witness a transformation that redefines the very foundation of technological innovation? CadenceLIVE Silicon Valley 2025 is set to be the epicenter of innovation, bringing together visionaries, technologists, and industry leaders und...
    • 14 Apr 2025
  • Cadence 推出業界首款 eUSB2V2 IP 解決方案

    Spotlight Taiwan: Cadence 推出業界首款 eUSB2V2 IP 解決方案

    candyyu
    candyyu
    為滿足高品質視訊傳輸、AI PC 等新型筆記型電腦及其他採先進技術的產品需求,並提供最佳用戶體驗,SoC晶片需採5 奈米及以下的先進製程,以實現最佳功耗、性能和面積 (PPA)。然而,隨著進入 5奈米以下的先進製程,SoC 供應商面臨高效能與低工作電壓(通常低於 1.2V)間的權衡。同時,對高解析度鏡頭、更快影格速率和AI驅動運算的需求不斷增長,需具備更高資料速率和減少電磁干擾 (EMI) 的介面。隨著產品效能要求變得越來越複雜,創新的解決方案顯得更為關鍵,以彌合功效和進階功能間的差距。 Ca...
    • 13 Apr 2025
  • MemryX – Scalable, High-Performance AI at the Edge

    Corporate News: MemryX – Scalable, High-Performance AI at the Edge

    Tanushri Shah
    Tanushri Shah
    AI has transformed the world around us. From reasoning models to agentic AI, they're all running on data centers, but very soon, they could run on our handheld devices. AI models are moving towards being developed on the cloud, and as they're...
    • 11 Apr 2025
  • Celebrating Together: IWD2025 at Cadence Ireland

    Life at Cadence: Celebrating Together: IWD2025 at Cadence Ireland

    Eleonora Blazhko
    Eleonora Blazhko
    Each March, we come together to celebrate International Women's Day (IWD) and honor the remarkable contributions of women who shape the world and inspire future generations. This year, the Cadence Women in Ireland Network (CWIN) proudly celebrat...
    • 9 Apr 2025
  • Functional Safety in a Disaggregated World

    SoC and IP: Functional Safety in a Disaggregated World

    MBhatnagar
    MBhatnagar

    We are witnessing a dramatic rise in disaggregation and a lot of discussion around chiplet-based design. There are multiple reasons for it: as monolithic dies grow larger, they hit reticle limits and much before that the yield drops precipitously making them uneconomical. That is where monolithic designs are headed and to stay economical, they need to disaggregate into chiplets. This is not the only reason. Cost per transistor…

    • 9 Apr 2025
  • Thermal Analysis of 3D Stacking and BEOL Technologies

    System, PCB, & Package Design : Thermal Analysis of 3D Stacking and BEOL Technologies

    MSATeam
    MSATeam

    Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization (STCO) promises to mitigate technology scaling bottlenecks with system architecture tuning based on emerging technology offerings, including 3D technology.

    3D-IC

    AI-driven inference accelerators continue to expand the 2D system…

    • 7 Apr 2025
  • Exploring Non-Linear Consecutive Relations in Turbulence: SSC-EARSM

    Computational Fluid Dynamics: Exploring Non-Linear Consecutive Relations in Turbulence: SSC-EARSM

    Gaurav
    Gaurav
    Key Takeaways The separation-sensitive corrected explicit algebraic Reynolds stress model (SSC-EARSM) is designed to better predict separated flows compared to the Simplified Baseline Explicit Algebraic Reynolds Stress Model (S-BSL-EARSM). The SSC-E...
    • 7 Apr 2025
  • Unlocking Efficient Debugging with the Verisium WaveMiner App

    Verification: Unlocking Efficient Debugging with the Verisium WaveMiner App

    Bhairava prasad
    Bhairava prasad
    Overview of the Verisium WaveMiner App

    Verisium WaveMiner is part of the Verisium suite of AI-driven verification tools that automate the root cause analysis of misbehavior introduced between two versions of the same RTL design. By analyzing passing and failing waveforms, Verisium WaveMiner ranks and highlights the signals and timepoints relevant to the misbehavior, simplifying the regression debug process.

           

    Why Do…
    • 3 Apr 2025
  • Unleash the Power of Photonics Design with A New Course on Virtuoso Layout

    Analog/Custom Design: Unleash the Power of Photonics Design with A New Course on Virtuoso Layout

    Sandhya P S
    Sandhya P S

    In the rapidly evolving field of photonics, designing and optimizing photonic integrated circuits (PICs) is crucial for advancing technology. As the demand for high-speed data transmission and optical communication continues to grow, the need for efficient and accurate photonic design tools has become increasingly important. Cadence's Virtuoso Layout for photonics design is a powerful tool that enables designers to create…

    • 3 Apr 2025
  • Boost Your Layout Productivity with Virtuoso Studio

    Analog/Custom Design: Boost Your Layout Productivity with Virtuoso Studio

    ErinGrant
    ErinGrant

    Please join Aires Manuel Terra, Lead Application Engineer for this free technical Training Webinar.

    In this webinar, we’ll show you how to keep up with ever-changing layout requirements and challenges. We’ll also demonstrate Virtuoso Layout Suite capabilities that boost layout designer productivity in Virtuoso Studio, such as:

    • Creating optimal floorplans that combine top-down and bottom-up methodologies…
    • 3 Apr 2025
  • Thermal Insights: How Legato Electrothermal Simulation Ensures Reliability

    Analog/Custom Design: Thermal Insights: How Legato Electrothermal Simulation Ensures Reliability

    Sree Parvathy
    Sree Parvathy

    Have you ever wondered how mission-critical systems in automotive, medical, aerospace, defense, and communications maintain their reliability even under extreme conditions? Consider the automotive industry, where electronic components must function reliably in the high-temperature environment under a vehicle's hood. By simulating these conditions, designers can validate the operation of over-temperature protection circuits…

    • 2 Apr 2025
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