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Cadence Japan

境界を越えて、未来を組み上げろ―ホンダ×ケイデンス

「AIは、物理世界にどう根付いていくのか？」をテーマに、本田技術研究所社 先進技術研究所（HGRX）との対談を通じて、AIと半導体の未来、フィジカルAIの可能性…

Cadence Japan
• less than a min read
Automotive , featured , physical ai , automotive electronics , japanese blog

SoC and IP

Powering Scale Up and Scale Out with 224G SerDes for UALink and Ultra Ethernet

As AI workloads grow in scale and complexity, networks are challenged to keep up…

Sheryl G
• 3 min read
Design IP , featured , 224G-LR , 224G SerDes , UALink

Corporate News

AI Infra Summit Highlights: Cadence's Unique Design for AI and AI for Design

The AI Infra Summit 2025 was a great experience that left attendees buzzing with…

Corporate
• 7 min read
featured , AI Infra Summit 2025 , AI for design , Cadence Reality Digital Twin Platform , design for AI

Corporate News

Ambarella Redefines Edge AI Performance with Cadence

Ambarella stands at the forefront of edge AI processing, pioneering low-power, high…

Corporate
• 4 min read
Edge AI , featured , Ambarella
cdns - all_blogs_categories

Blog - Post List

Latest blogs

Analog/Custom Design

Calculating Large Signal Phase Noise Using Transient Noise Analysis

My name is Alan Whittaker and I'm in Cadence's Custom IC Proliferation Group. We…

• 2 min read
PLL , MMSIM , RF design , Circuit Design , Simulators , Custom IC Design

Digital Design

Get on Board With Bus Guides

One of the coolest new things in Encounter 8.1 is Bus Guides. I know many of you…

• 2 min read
Bus Guides , encounter , 8.1 , Digital Implementation

System, PCB, & Package Design 

What's Good About Cline Change Width in APD? It's in SPB16.2!

In IC package design, it is becoming increasingly necessary to change a cline’s width…

• 2 min read
SPB 16.2 , APD , PCB design , Cline change

Verification

Generation Action: Constraints From Above

[Welcome guest blogger Reuven Naveh of Specman R&D] What is the “constraints from…

• 6 min read
IEEE 1647 , IntelliGen , Specman , Functional Verification , e , Aspect Oriented Programming , Incisive Enterprise Simulator (IES) , IES , AOP , IES-XL

Verification

Moving Low Power Chip Design up to the System Level

Anybody watching Cadence these past couple years has probably noticed how we're pretty…

• 1 min read
System Design and Verification , Palladium , incyte , C-to-Silicon Compiler

Analog/Custom Design

Moving an Ecosystem

Recently, a colleague here at Cadence created the image of an ecosystem , whose existence…

• 1 min read
ecosystem , Virtuoso , CAD , Custom IC Design

SoC and IP

Company Financials for 4Q08. Not Good

Memory Makers lose $8.8B in 4Q2008, to bring annual losses to $20B: Memory companies…

• 14 min read

Verification

Tracing TLM 2.0 Activity In An ESL Design – Part I

Many design teams that use SystemC are in various stages of evaluating TLM 2.0 –…

• 6 min read
TLM , System Design and Verification , TLM 2.0 , SystemC analysis , George Frazier , sctlmrecord , ESL

Verification

Making the Right Decisions *Before* You Start Your Project

Seems logical, but unfortunately, I run into customers today that grumble about their…

• 3 min read
InCyte IP , chipestimate , System Design and Verification , chip estimation

Verification

Connecting OVM Testbench and SystemC TLM2 IP

1. Introduction With TLM2 enabling more sophisticated SystemC IP interoperability…

• 9 min read
TLM2 IP , System Design and Verification , OVM , SystemC , testbench

Verification

C-to-Silicon Compiler Is The Only ESL Tool With ECO Capabilities

Another key differentiator of C-to-Silicon Compiler (CtoS) when compared to other…

• 1 min read
ECO , CTOS , RTL , System Design and Verification , C-to-Silicon , ESL

Verification

IMPORT Guidelines For e, Part 1

[Team Specman welcomes AE Manager Avi Behar as our newest guest blogger] Hi, my name…

• 4 min read
IntelliGen , Specman , Functional Verification , Avi Behar , OVM e , Register Package , e , OVM-e , specman elite , Aspect Oriented Programming , eRM , Incisive Enterprise Simulator (IES) , IES , AOP , IES-XL

Digital Design

'Back to School' in April? Are you Kidding?

No, I am not kidding. in fact, we have planned several 'back to school' seminars…

• 1 min read
digital Implementationg , Low Power , encounter 8.1 , Low-Power , encounter , Manufacturability sign-off , 8.1 , Digital Implementation , "SoC-Encounter" , Encounter Digital Implementation System 8.1

Verification

DVCon '09 SaaS Panel Thoughts, Part 2

In my last post on the DVCon 2009 panel on Software As A Service , or " SaaS " as…

• 3 min read
security , SaaS , Functional Verification , Harry The ASIC Guy , DVcon

RF Engineering

Setting Up Harmonic Balance - Part 1

This is the first of a series of Blogs to talk about how to fill out the forms for…

• 3 min read
MMSIM71 , Spectre RF , spectreRF , RF design , harmonic balance

System, PCB, & Package Design 

What's Good About Dynamic Fillets in Allegro PCB Editor? Check out the SPB16.2 Release

The existing Fillet application, a function of the Gloss routine, has been enhanced…

• 1 min read
SPB 16.2 , PCB Editor , Allegroro , PCB design , Dynamic Fillets , t-juntions

System, PCB, & Package Design 

It’s All In The Metrics

You could be forgiven for thinking that this was going to be a discussion of the…

• 3 min read
Allegro Design Workbench , PCB design , metrics , enterprise integration

Digital Design

Does Noise Analysis Accuracy Really Matter?

There have been a lot of new faces springing up in the signoff analysis market over…

• 2 min read
Static timing analysis , Signoff Analysis , STA , Advanced Node , Mixed-Signal , 8.1 , Encounter Digital Implementation , CeltIC NDC , Global Timing Debug , SSTA , "SoC-Encounter"

SoC and IP

Taiwan Memory Company (TMC), Part III

"EDIT: I have corrected Etron's 2007 P& L entry to show a net profit of 39M instead…

• 7 min read
CDNS - Fix Layout Hompage