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Latest Blog Posts

  • Generative AI in Design Tools: Solving the Engineering Productivity Crisis

    Corporate News: Generative AI in Design Tools: Solving the Engineering Productivity Crisis

    Steve Brown
    Steve Brown
    People are adopting more and more technologies like AI into their lives. New intelligent devices are fueling growth in our economy. Meanwhile, there’s a huge talent gap of highly trained or even entry-level electronic engineers to design next-g...
    • 8 Sep 2023
  • DEI@Cadence: Why Words Matter for One Cadence—One Team

    Life at Cadence: DEI@Cadence: Why Words Matter for One Cadence—One Team

    David Junkin
    David Junkin
    Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you’ll find a community where employees share their perspectives and experiences. By provi...
    • 8 Sep 2023
  • finot-conq Is Designing Award-Winning Yachts with Fidelity Fine Marine

    Corporate News: finot-conq Is Designing Award-Winning Yachts with Fidelity Fine Marine

    Tanushri Shah
    Tanushri Shah
    For over 50 years, finot-conq has been at the forefront of the yacht design industry, and over 45,000 boats have been produced from finot-conq designs, including production boats, cruising boats, and racing prototypes. In the past 15 years, their pro...
    • 7 Sep 2023
  • AI PCB Design: ジェネレーティブAIが我々をコンストレイントから可能性へと導く方法

    PCB設計/ICパッケージ設計: AI PCB Design: ジェネレーティブAIが我々をコンストレイントから可能性へと導く方法

    SPB Japan
    SPB Japan
    ジェネレーティブAI(または生成AI)は、PCB設計における次の大きな一歩を示します。  もちろん、この言葉は期待通りのものでしょう。2023年はジェネレーティブAIの台頭に支配された年であり、大規模言語モデル(LLM)はそのまぎれもなく代表的な存在です。理由は簡単です。LLMは、一見、知覚としての要件を満たしているように見えるのです。ただ、実際には、過去のデータとリアルタイムのデータの両方から文脈を推定するのが非常にうまいだけなのですが。  “ジェネレーティブA...
    • 7 Sep 2023
  • Training Webinar: Microwave Office: An Integrated Environment for RF and Microwave Design

    RF Engineering: Training Webinar: Microwave Office: An Integrated Environment for RF and Microwave Design

    John Dunn
    John Dunn
    A recording of a training webinar on Microwave Office is available. Topics show the design environment, with special emphasis placed on electromagnetic (EM) simulation. Normal 0 false false false EN-US JA X-NONE .…
    • 6 Sep 2023
  • Reutlingen University Certified as Cadence Academic Network Lab

    Academic Network: Reutlingen University Certified as Cadence Academic Network Lab

    Anton Klotz
    Anton Klotz
    Let’s start with a confession: Reutlingen is not the most famous city in Germany, not even in the top 10. It’s a mid-sized town in the vicinity of Stuttgart, close to the Swabian Alps, and, according to the Guinness Book of Records, it ha...
    • 6 Sep 2023
  • Cadence TECHTALK - Efficient Thermal Management for Enhanced Electronics Performance​

    Computational Fluid Dynamics: Cadence TECHTALK - Efficient Thermal Management for Enhanced Electronics Performance​

    Veena Parthan
    Veena Parthan
    Come join our one-hour session to discover how the Celsius EC Solvers utilizes data to analyze natural convection, forced convection, liquid cooling, and solar cooling. This results in increased accuracy and faster simulation time when modeling electronic equipment. Don't miss out on this opportunity to enhance your knowledge!
    • 5 Sep 2023
  • Virtuoso Meets Maxwell: Custom Passive Device Authoring – パート 2 (LVS)

    カスタムIC/ミックスシグナル: Virtuoso Meets Maxwell: Custom Passive Device Authoring – パート 2 (LVS)

    Custom IC Japan
    Custom IC Japan
    'Virtuoso Meets Maxwell'はVirtuoso RFソリューションとVirtuoso MultiTechの機能及びその潜在能力の紹介を目的としたブログの連載です。ではどのようにVirtuosoがMaxwellと出会うのでしょうか。現在、VirtuosoプラットフォームはRF設計をサポートしており、RF設計者は物理的な放射の影響をマクスウェルの方程式で測ります。この連載では、有益なソフトウェアの改善点にスポットを当てて解説するだけでなく、VirtuosoのIC-...
    • 5 Sep 2023
  • Introducing PCIe's Integrity and Data Encryption Feature (IDE)

    Verification: Introducing PCIe's Integrity and Data Encryption Feature (IDE)

    Felipe Goncalves
    Felipe Goncalves

    The Integrity and Data Encryption (IDE) was published in PCIe (Peripheral Component Interconnect Express) version 6.0, and it was created as a tool to protect the communication between the different devices of the PCIe topology root complex (RC), switch (SW), and endpoint (EP). The IDE layer is a new layer that was inserted between the transection layer and data link layer with the goal of protecting against threats from…

    • 5 Sep 2023
  • AI PCB Design: How Generative AI Takes Us from Constraints to Possibilities

    Corporate News: AI PCB Design: How Generative AI Takes Us from Constraints to Possibilities

    Michael Jackson
    Michael Jackson
    Generative artificial intelligence (AI) represents the next great step forward in PCB design. This is, of course, what you might expect me to say. 2023 has been a year dominated by the rise of generative AI, with large language models (LLMs) as the u...
    • 5 Sep 2023
  • Unraveling the PCIe.6.0 Compliance Feature

    Verification: Unraveling the PCIe.6.0 Compliance Feature

    sabnams
    sabnams

    In PCI Express (PCIe) devices, there is a need for testing near-worst-case inter-symbol interference (ISI) and cross-talk so as to ensure data flow with minimal distortion and noise. To accommodate this in PCIe, we have a separate LTSSM state as polling.compliance state. This phase will generate patterns named compliance pattern, modified compliance pattern, jitter pattern, and toggle pattern (a new feature added in PCIe…

    • 5 Sep 2023
  • Fidelity CFD Technology Update Part I – Aerospace Design

    Computational Fluid Dynamics: Fidelity CFD Technology Update Part I – Aerospace Design

    Veena Parthan
    Veena Parthan
    There are always a few tricks and tips for an easy yet effective solution to a design problem. For aerospace applications, this is no different! This blog post will delve into the meshing tools and solvers integrated within the Cadence Fidelity CFD platform that can ease your next aerospace design.
    • 4 Sep 2023
  • System Analysis Knowledge Bytes: Using PowerDC for Multi-Board IR Drop Analysis

    System, PCB, & Package Design : System Analysis Knowledge Bytes: Using PowerDC for Multi-Board IR Drop Analysis

    Jasmine
    Jasmine
    This blog is about performing IR Drop analysis on a multi-board package using PowerDC. It lists the steps to set up the simulation and view the simulation results. References to the RAK on Multi-Board IR Drop Analysis using PowerDC are included.
    • 4 Sep 2023
  • Labforge Brings AI into Vision Systems with Cadence

    Corporate News: Labforge Brings AI into Vision Systems with Cadence

    Reela Samuel
    Reela Samuel
    Labforge, a company based in Waterloo, Ontario, designs, builds, and manufactures smart cameras used in industrial automation and defense applications. Their flagship product, the Bottlenose smart camera, is a low-power device that can process compu...
    • 31 Aug 2023
  • Spectre Tech Tips: Introducing Spectre FMC Analysis

    Analog/Custom Design: Spectre Tech Tips: Introducing Spectre FMC Analysis

    Jianhe Guo
    Jianhe Guo
    The Spectre FMC Analysis uses advanced statistical and machine learning (ML) techniques to achieve the same accuracy as the Brute Force Monte Carlo method with the minimum number of Monte Carlo simulations. This blog describes how to set up and run FMC analysis in Spectre standalone mode.
    • 31 Aug 2023
  • Voltus Voice: Multi-Chiplet Marvels - Stepping into the 3D-IC Signoff Realm

    Digital Design: Voltus Voice: Multi-Chiplet Marvels - Stepping into the 3D-IC Signoff Realm

    Louis Tsai
    Louis Tsai
    Read this blog to understand how the Voltus 3D-IC power and IR signoff flow helps to verify the overall power grid logical connectivity and IR/EM performance of the complete system.
    • 31 Aug 2023
  • Virtuoso Studio: デザイン、プランニング、解析 – コインの3つの側面、エピソード1

    カスタムIC/ミックスシグナル: Virtuoso Studio: デザイン、プランニング、解析 – コインの3つの側面、エピソード1

    Custom IC Japan
    Custom IC Japan
    当社の新しい AI 搭載カスタム設計ソリューション Virtuoso Studio は、我々の30年にわたる業界の知識とリーダーシップを活用し、革新的な機能、比類のない生産性を実現する再構築されたインフラストラクチャ、および従来の設計の枠を超えた新しいレベルの統合環境を提供します。このブログシリーズでは、最高のアナログ設計ツールがどのように改良され、困難な設計課題に対応できるようになったかを紹介します。 Design Planning and Analysis ツールは、Virtuoso Lay...
    • 30 Aug 2023
  • Power Up Your Low-Power Verification - A Quick Overview

    Verification: Power Up Your Low-Power Verification - A Quick Overview

    Tyler Sherer
    Tyler Sherer

    Handheld devices have evolved immensely over the past decade. Today's smartphones, with their intricate arrays of sensors and computational power, far surpass their predecessors in complexity. These modern devices rival the capabilities of past supercomputers. When you factor in the intricate power management demanded by battery constraints, verifying these devices becomes a uniquely challenging task.

    The complexity of low power verification

    Figure 1: The…

    • 30 Aug 2023
  • Virtuoso Meets Maxwell: Virtuoso Electromagnetic Solver Assistant - 繰り返しインスタンスのサポート

    カスタムIC/ミックスシグナル: Virtuoso Meets Maxwell: Virtuoso Electromagnetic Solver Assistant - 繰り返しインスタンスのサポート

    Custom IC Japan
    Custom IC Japan
    'Virtuoso Meets Maxwell'はVirtuoso RFソリューションとVirtuoso MultiTechの機能及びその潜在能力の紹介を目的としたブログの連載です。ではどのようにVirtuosoがMaxwellと出会うのでしょうか。現在、VirtuosoプラットフォームはRF設計をサポートしており、RF設計者は物理的な放射の影響をマクスウェルの方程式で測ります。この連載では、有益なソフトウェアの改善点にスポットを当てて解説するだけでなく、VirtuosoのIC-...
    • 29 Aug 2023
  • Best Practices to Achieve the Highest Performance Using Cadence Xcelium Logic Simulator – Part 3

    Verification: Best Practices to Achieve the Highest Performance Using Cadence Xcelium Logic Simulator – Part 3

    Reela Samuel
    Reela Samuel

    Our previous posts in this series covered measuring parameters, switches, and profiling, as well as performing profile analysis. In this final post will examine how to analyze a basic profiler report. This includes examining the stream count, identifying the most active modules, and reviewing the summary section. Additionally, we will discuss techniques for optimizing settings and managing access levels.

    Analyzing Basic…
    • 28 Aug 2023
  • 4th Generation Intel Xeon Scalable Processors for Faster Fidelity CFD Computations

    Computational Fluid Dynamics: 4th Generation Intel Xeon Scalable Processors for Faster Fidelity CFD Computations

    JoshuaS
    JoshuaS
    The Intel® Xeon® processor family has long been a popular choice for CFD hardware, both in workstations and in HPC clusters. The Intel® Xeon® processor Scalable family in particular is targeted at HPC applications, where it has b...
    • 28 Aug 2023
  • Neurinnov Is Transforming Tetraplegic Patient Care with Cadence

    Corporate News: Neurinnov Is Transforming Tetraplegic Patient Care with Cadence

    Reela Samuel
    Reela Samuel
    We are excited to share the latest developments from Neurinnov, a company working to restore hand movements for patients with complete tetraplegia following high-level spinal cord injury. Neurinnov's first clinical indication is focused on resto...
    • 28 Aug 2023
  • Reinvigorate Silicon Design with AWS

    Cloud: Reinvigorate Silicon Design with AWS

    Vinod Khera
    Vinod Khera
    Innovations in silicon design have fueled recent technological advancements in the electronic industry. Chips, from mobile devices to cars and healthcare systems, are now pervasive and essential to our daily lives. The increasing functionality of SoC...
    • 27 Aug 2023
  • 信号如何在无限大的导电介质中传播

    PCB、IC封装:设计与仿真分析: 信号如何在无限大的导电介质中传播

    Sigrity
    Sigrity
    本文要点: PCB 上的传输线是波导的一种形式,沿着波导的边界形成了一个开放的谐振器结构。 铜所具有的非理想性质会改变传输线结构中的典型波导行为。 一般传输线的阻抗可以通过考虑波的传播行为来计算,前提是必须兼顾导体的非理想性质。 传输线有许多种形式,如同轴线、印刷电路板上的印刷走线,或是长电缆或电线。这些结构都有一些类似的行为,涉及到电磁波如何沿互连线传播。尽管这些结构是引导电磁扰动沿互连线传播的基础,但对于信号如何在传输线上传播,人们往往存在误解。 具体而言,互连线上的电磁信号存在于线路的...
    • 25 Aug 2023
  • 一文了解 PCB 的有效导热系数

    PCB、IC封装:设计与仿真分析: 一文了解 PCB 的有效导热系数

    Sigrity
    Sigrity
    本文要点 PCB 有效导热系数的定义。 影响 PCB 有效导热系数的关键因素。 了解热模型中有效导热系数的准确度。 什么是 PCB 有效导热系数? “有效导热系数”代表材料的传导热能力。我们谈及PCB时,有效导热系数指的是 PCB 将器件产生的热量转移到周围区域的能力。有效导热系数用 Keff 表示,单位是 W/m-K。 在 PCB 设计中,有效导热系数是热建模和分析中使用的一个重要参数,有助于工程师根据特定的假设和模型,预测一块摆满器件的 PCB 的导热效果。随着电...
    • 25 Aug 2023
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