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Latest Blog Posts

  • Fuel Economy and Aerodynamics: The Yin and Yang of Car Design

    Computational Fluid Dynamics: Fuel Economy and Aerodynamics: The Yin and Yang of Car Design

    Veena Parthan
    Veena Parthan
    From the classic Model T to the iconic American muscle cars, the design of cars has been shaped by many factors over the years. But one factor that has been a game changer is fuel efficiency. Next time you admire the sleek lines of a modern car, remember that it's not just about looks - every curve and contour has been carefully designed to maximize fuel efficiency and minimize air resistance.
    • 17 Jan 2024
  • See You at the Euromaritime Trade Fair in Marseille!

    Computational Fluid Dynamics: See You at the Euromaritime Trade Fair in Marseille!

    Veena Parthan
    Veena Parthan
    We are excited to announce that Euromaritime, the renowned exhibition dedicated to the marine industry, will be held from January 30th to February 1st at the Parc Chanot in Marseille. This is the city's third consecutive edition of the event, affirming its strong connection to Marseille.
    • 17 Jan 2024
  • Ascent: Training Insights: Allegro X System Capture Basics トレーニングコースのご紹介

    PCB設計/ICパッケージ設計: Ascent: Training Insights: Allegro X System Capture Basics トレーニングコースのご紹介

    SPB Japan
    SPB Japan
    Allegro X System Capture は、PCB 設計のための完全なエコシステムを提供します。Allegro X System Captureに内蔵されたデータ管理機能により、回路図やシステムの設計が容易になります。   初心者の方の回路設計スタートを支援するために、新しいコースとしてAllegro X System Capture Basics が用意されました。このコースでは、回路図の作成から基板用ネットリストの生成までが学べます。 使いやすく直感的なモジュー...
    • 15 Jan 2024
  • Allegro X Design Support Portal: A One-Stop Solution to Learning Resource Center

    System, PCB, & Package Design : Allegro X Design Support Portal: A One-Stop Solution to Learning Resource Center

    Jasmine
    Jasmine
    The advent of a new year brings new hopes and possibilities to fulfill your true potential and attain your goals. This new year, Cadence strives to achieve high levels of customer satisfaction by unveiling a new learning resource center for its ...
    • 15 Jan 2024
  • Can Data Centers Afford to Turn Up the Heat?

    Data Center: Can Data Centers Afford to Turn Up the Heat?

    MarkSeymour
    MarkSeymour
    Typically, when we discuss our digital twin software for data centers, we highlight how engineers can use our data center software to model complex thermals using physics-based simulation and find effective ways to cool IT equipment. However, there ...
    • 11 Jan 2024
  • The Year That Was: Knowledge Booster Training Bytes — Highlights from 2023

    Analog/Custom Design: The Year That Was: Knowledge Booster Training Bytes — Highlights from 2023

    Parula
    Parula
    This blog takes us back into 2023 and highlights our new blogs, trainings, and training bytes throughout the year. It also mentions the new digital badges and the trainings that were updated to the next version.
    • 11 Jan 2024
  • Save Your Time and Effort in Optimizing a Differential Pair Via Transition

    System, PCB, & Package Design : Save Your Time and Effort in Optimizing a Differential Pair Via Transition

    Vinod Khera
    Vinod Khera
    Technology has become an essential part of our lives and is transforming our world. However, this leads to complex system design complexity and increased design simulation parameters required to ensure performance, functionality, and reliability conc...
    • 10 Jan 2024
  • GUC Tapes Out Complex 3D Stacked Die Design on Advanced FinFET Node Using Cadence Integrity 3D-IC Platform

    Corporate News: GUC Tapes Out Complex 3D Stacked Die Design on Advanced FinFET Node Using Cadence Integrity 3D-IC Platform

    Corporate
    Corporate
    Global Unichip Corporation (GUC), a leading global ASIC provider, has successfully taped out a complex 3D stacked die design on an advanced FinFET node process. The design, which involves a memory-on-logic configuration achieved with a wafer-on-wafer...
    • 10 Jan 2024
  • What Makes Fidelity the Preferred Choice for Large Eddy Simulation (LES)?

    Computational Fluid Dynamics: What Makes Fidelity the Preferred Choice for Large Eddy Simulation (LES)?

    Veena Parthan
    Veena Parthan
    LES is now more accessible and affordable, thanks to modern numerics and GPU acceleration. Fidelity LES solver is a game-changer in LES modeling due to its low dissipation numerical schemes, stable mesh generation, and grid insensitivity. Its practical application has been demonstrated in various industries, making high-fidelity LES simulations possible.
    • 8 Jan 2024
  • Let's Discover the Secret to Enhance Design's PPAC in a Single Cockpit!

    Digital Design: Let's Discover the Secret to Enhance Design's PPAC in a Single Cockpit!

    Neha Joshi
    Neha Joshi

    Traditionally, you would do power, performance, area, and congestion (PPAC) analysis for a design as you move forward with different stages in the flow.

    But with highly advanced technology, the real designs are getting complex and interdependent, complicating the analysis at each stage!! Hence, attaining PPAC goals can be very convoluted and crucial as the clock keeps ticking for the tapeout time. What is the challenge…

    • 8 Jan 2024
  • WPI Is Enabling Non-Invasive Patient Monitoring

    Corporate News: WPI Is Enabling Non-Invasive Patient Monitoring

    Tanushri Shah
    Tanushri Shah
    According to Worcester Polytechnic Institute (WPI), the future of medicine is the ability to remotely monitor patients in a simple and accurate way. The new sensor that they’ve developed does just that. It allows thousands of different patients...
    • 4 Jan 2024
  • Karuna Narayan Kadam: An Exemplar of How Resilience Can Conquer Adversity

    The India Circuit: Karuna Narayan Kadam: An Exemplar of How Resilience Can Conquer Adversity

    Asim Khan
    Asim Khan
    Karuna's story began in the narrow streets of Pune, where her father, a hardworking truck driver, tried to support Karuna, her mother, and two siblings. Despite attending government schools with limited resources, Karuna achieved an impressive 91...
    • 2 Jan 2024
  • The Year That Was: Cadence PCB and Package Design Blogs in 2023

    System, PCB, & Package Design : The Year That Was: Cadence PCB and Package Design Blogs in 2023

    Mansi Rana
    Mansi Rana
    Happy New Year! As we welcome 2024, we would like to take a moment to express our gratitude for your continued encouragement and support for our blogs published in 2023. In this special blog, we’ll look at some of the most-v...
    • 2 Jan 2024
  • Analog/Custom Design: The 6 Requirements of Effective Analog Layout Automation

    Mark Williams
    Mark Williams

    Analog Layout remains a time consuming manual task to most layout designers. For as long as integrated circuits have existed, designers have been manually placing individual transistors, drawing every shape and guard ring, and routing every wire by hand. Digital layout automation on the other hand, became almost completely automated. As early as the mid 1980’s EDA pioneers at Tangent Systems allowed digital blocks with…

    • 31 Dec 2023
  • Virtuoso Meets Maxwell: Virtuoso 3D Viewerを使用したEMX電流密度の解析

    カスタムIC/ミックスシグナル: Virtuoso Meets Maxwell: Virtuoso 3D Viewerを使用したEMX電流密度の解析

    Custom IC Japan
    Custom IC Japan
    'Virtuoso Meets Maxwell'はVirtuoso RFソリューションとVirtuoso MultiTechの機能及びその潜在能力の紹介を目的としたブログの連載です。ではどのようにVirtuosoがMaxwellと出会うのでしょうか。現在、VirtuosoプラットフォームはRF設計をサポートしており、RF設計者は物理的な放射の影響をマクスウェルの方程式で測ります。この連載では、有益なソフトウェアの改善点にスポットを当てて解説するだけでなく、VirtuosoのIC-...
    • 26 Dec 2023
  • proteanTecs Is Helping Electronics Monitor their Health

    Corporate News: proteanTecs Is Helping Electronics Monitor their Health

    Tanushri Shah
    Tanushri Shah
    For technologies like autonomous vehicles, data centers, and mobile communications, semiconductors are their hearts. Much like human hearts, it’s important to monitor the health and performance of a semiconductor throughout its life cycle. As a...
    • 21 Dec 2023
  • What Is Viral in CXL 3.0?

    Verification: What Is Viral in CXL 3.0?

    Rajneesh Chauhan
    Rajneesh Chauhan
    Introduction to CXL 3.0

    CXL 3.0 is an open-standard interconnect technology that builds upon PCIe 6.0 to facilitate high-speed communication between CPUs and peripheral devices. With a doubled bandwidth of 64 GT/s and enhanced fabric capabilities, CXL 3.0 aims to optimize system-level flows, improve resource utilization, and enable new device types for composable disaggregated infrastructure.

    Unveiling the Viral Feat…
    • 21 Dec 2023
  • Revolutionizing Automotive Design with Chiplet-Based Architecture

    System, PCB, & Package Design : Revolutionizing Automotive Design with Chiplet-Based Architecture

    Reela Samuel
    Reela Samuel

    Automotive and Chiplets

    The global chip market has seen a significant increase in demand for high-performance chips due to the rapid growth of the automotive industry. This growth is primarily driven by the adoption of advanced driver-assistance systems (ADAS), electric vehicles (EVs), and connected cars. These technologies require fast data processing, improved sensor fusion, and better communication capabilities to enhance vehicle performance…

    • 21 Dec 2023
  • Voltus Voice: Navigating 2023 - A Recap of our Blogging Odyssey

    Digital Design: Voltus Voice: Navigating 2023 - A Recap of our Blogging Odyssey

    Anshika Gahlaut
    Anshika Gahlaut
    A recap of the power integrity posts in the Voltus Voice blog series through 2023.
    • 21 Dec 2023
  • Voltus Voice: Multi-Chiplet Marvels – Exploring Chip-Centric Thermal Analysis

    Digital Design: Voltus Voice: Multi-Chiplet Marvels – Exploring Chip-Centric Thermal Analysis

    Louis Tsai
    Louis Tsai
    Dive into the intricate world of chip-centric thermal analysis to understand its crucial role in thermal management.
    • 20 Dec 2023
  • Cadence Academic Network - A Year in Review

    Academic Network: Cadence Academic Network - A Year in Review

    Kira Jones
    Kira Jones
    Each year that passes, we are delighted by the growth of our community! We’re excited about the collaborations forged, the innovation among student design teams, the advancement of curriculum, and so much more. We wanted to highlight the amazin...
    • 20 Dec 2023
  • Cadence Doc Assistant: Elevate Your Knowledge With Our Next-Gen Help System

    Digital Design: Cadence Doc Assistant: Elevate Your Knowledge With Our Next-Gen Help System

    SSV Release Team
    SSV Release Team

    The SSV 23.1 release comes with a brand-new content delivery application called Cadence Doc Assistant, shortened to Doc Assistant, the next-gen app for content searching, navigation, and presentation.

    Doc Assistant, with its simplified content classification and standardized content, smoothens the content discovery process to ensure that you get the help you seek with minimal effort and maximum speed and accuracy. This…

    • 20 Dec 2023
  • SSV 23.1 Base Release Now Available

    Digital Design: SSV 23.1 Base Release Now Available

    SSV Release Team
    SSV Release Team
    The Silicon Signoff and Verification (SSV) 23.1 release is now available for download.
    • 20 Dec 2023
  • Training Insights – Implement Your Digital Circuits Using Virtuoso Digital Implementation!

    Digital Design: Training Insights – Implement Your Digital Circuits Using Virtuoso Digital Implementation!

    P Saisrinivas
    P Saisrinivas

    Are you excited to know more about the Virtuoso Digital Implementation flow, which is recommended especially for small digital blocks? Are you working on mixed-signal designs? Well, read on to know how to use this flow to implement your digital blocks!

    What is Virtuoso Digital Implementation?

    Virtuoso Digital Implementation is a license package built for the digital implementation platform. It helps design digital circuits…

    • 20 Dec 2023
  • Cadence Soars Up the Wall Street Journal List of Best Managed Companies in 2023

    Corporate News: Cadence Soars Up the Wall Street Journal List of Best Managed Companies in 2023

    Corporate
    Corporate
    We are thrilled to announce that Cadence has secured the #74 spot on the 2023 Wall Street Journal List of Best Managed Companies. This notable ranking places us at the forefront of our industry, alongside renowned tech giants such as Microsoft and Ap...
    • 19 Dec 2023
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