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SoC and IP

The Next-Generation UCIe IP Subsystem for Advanced Package Designs

With the rapidly increasing connectivity demands driven by AI/ML and HPC/data center…

MBhatnagar
• 3 min read
ucie , Design IP , featured , TSMC , die-to-die

Corporate News

Cadence at the TSMC OIP: Pioneering the Future of Semiconductor Design

The semiconductor industry stands at a pivotal moment. As we push toward more advanced…

Corporate
• 3 min read
OIP , featured , 3D-IC , 3DIC , TSMC

Corporate News

Building a Future Beyond Boundaries with Honda and Cadence

We at Cadence are proud to be a long-term partner of Honda R&D (HGRX), and our collaboration…

Corporate
• 6 min read
Automotive , featured , physical ai , automotive electronics , AI

Corporate News

CadenceLIVE India 2025 Recap – Where Inspiration Meets Innovation

On August 13, 2025, CadenceLIVE India 2025 set the stage for a remarkable convergence…

Reela Samuel
• 2 min read
featured , cadence , AI-Driven Design , cadencelive , AI
cdns - all_blogs_categories

Blog - Post List

Latest blogs

Breakfast Bytes

Sunday Brunch Video for 1st May 2022

https://youtu.be/TERyp8U7PCY Made at Parker Ranch, Saratoga (camera Carey) Monday…

• less than a min read
sunday brunch

PCB、IC封装：设计与仿真分析

NUMECA、CFD与美洲杯帆船赛

本文翻译自Cadence “Breakfast Bytes Blogs”专栏作者Paul McLellan文章" NUMECA, Computational Fluid…

• less than a min read
CFD , Chinese blog , 流体力学 , 计算流体动力学 , 中文 , 系统分析 , NUMECA , 多物理场仿真

Verification

System Verification Scoreboard: Its Role and Partnership with Verification IPs

As discussed in the last installment of the blog, a robust system level scoreboard…

• 1 min read
Verification IP , scoreboard , SoC verification , Hardware Coherency

Breakfast Bytes

April Update: USB-C, Great Place to Work, Intel Fab Tour, DALL-E

It's the last Friday in April already, so time for one of my monthly updates where…

• 4 min read
update , USB-C

Analog/Custom Design

Spectre Tech Tips: Using the Spectre Strobe Feature

From time to time, we observe Spectre customers using the maxstep feature for applications…

• 4 min read
Fast Fourier Transform , ADE Explorer , strobe , Spectre Circuit Simulator , Virtuoso Analog Design Environment , Virtuoso IC6.1.8 , ADE Assembler

Analog/Custom Design

Knowledge Booster Training Bytes — Registrations Open: Enhancing Layout Productivity…

We are going to host a webinar on Virtuoso Layout Pro Training in the upcoming month…

• 4 min read
Cadence Digital Badges , Cadence Floorplanner , Virtuoso Layout Productivity , Module Generator , Cadence Design Planner , Cadence training , training bytes , Cadence Education Services , Custom IC Design

Computational Fluid Dynamics

Introducing Cadence Fidelity CFD Software

On 19 Apr 2022 we announced Fidelity CFD. As you can imagine, it has dominated my…

• 3 min read
CFD , Computational Fluid Dynamics , fluid dynamics , Fidelity CFD , Mesh Generation

Breakfast Bytes

Syntiant Wins MLPerf TinyML Benchmark (with Help from Tensilica HiFi)

Earlier this month, MLCommons announced the latest round of results for inference…

• 4 min read
hifi 5 , mlperf tiny , Tensilica , mlperf

Computational Fluid Dynamics

Computational Fluid Dynamics Helps Marine Life Communicate

CFD simulations can help control noise emitted by cavitation-infected ship propellers…

• 4 min read
CFD , Electrification , cavitation , marine , noise pollution , ship propellers , simulation software , electric boats , marine life , under radiated noises , ecological balance

Breakfast Bytes

Linley: AI Moving to the Edge

Last week was the Linley Spring Processor Conference. One change since last year…

• 6 min read
hopper , deep learning , Linley , neural network , AI

System, PCB, & Package Design 

What's New in Clarity 3D Solver: Advancing In-Design EM Analysis

Increase both performance and capacity for chip, package, and PCB EM analysis with…

• less than a min read

System, PCB, & Package Design 

Silicon Chips: EM Simulation for Passive Circuit Analysis & Model Development

Modern electrical system design for 5G wireless systems and connected devices for…

• less than a min read

System, PCB, & Package Design 

3D-IC: System-Level Electrical and Thermal Challenges

3D-ICs (the latest technology for fitting more functionality onto a smaller chip…

• less than a min read
3DIC , in-design analysis , Thermal Integrity

System, PCB, & Package Design 

All Systems Go! Find and Fix Thermal PCB Problems Sooner Than Later

Electrothermal co-simulation—understanding the implications (intended or otherwise…

• 1 min read

RF Engineering

RF/Microwave System Design Trends

David Vye of Cadence and Dave Maliniak of Microwaves & RF magazine discuss the Cadence…

• less than a min read
RF , featured , awr

RF Engineering

In-Design EM Analysis for Microwave/RF Design and Verification Workflows

3D finite element method (FEM) and 3D planar method of moments (MoM) have become…

• less than a min read
in-design analysis , electromagnetic , microwave design

System, PCB, & Package Design 

All Systems Go! Ensuring Power Integrity—Explore, Design, and Verify

When designing an electronic system, ensuring power integrity (PI) is all about making…

• less than a min read

System, PCB, & Package Design 

All Systems Go! - Bridging the Gap Between Design and Analysis

Electronic designs are increasing in capacity, complexity, and performance.  Of course…

• less than a min read

System, PCB, & Package Design 

High-Tech Everything

Is there any industry left in today’s automated world that does not embrace some…

• 1 min read
CDNS - Fix Layout Hompage