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Featured

Corporate News

New Ultra-Fast Debug Solution for Palladium Emulation with Verisium Debug

Verification engineers continually report that up to 70% of the total engineering…

Corporate
Corporate 9 Oct 2025 • 2 min read
news story , featured , verisium , AI

Corporate News

Cadence Recognized as TSMC OIP Partner of the Year at 2025 OIP Ecosystem Forum

The semiconductor industry thrives on collaboration, and few pairings exemplify this…

Corporate
Corporate 8 Oct 2025 • 2 min read
featured , cadence , OIP Partner of the Year , AI-Driven Design , TSMC

Cadence Japan

境界を越えて、未来を組み上げろ―ホンダ×ケイデンス

「AIは、物理世界にどう根付いていくのか?」をテーマに、本田技術研究所社 先進技術研究所(HGRX)との対談を通じて、AIと半導体の未来、フィジカルAIの可能性…

Cadence Japan
Cadence Japan 8 Oct 2025 • less than a min read
Automotive , featured , physical ai , automotive electronics , japanese blog

SoC and IP

Powering Scale Up and Scale Out with 224G SerDes for UALink and Ultra Ethernet

As AI workloads grow in scale and complexity, networks are challenged to keep up…

Sheryl G
Sheryl G 7 Oct 2025 • 3 min read
Design IP , featured , 224G-LR , 224G SerDes , UALink
cdns - all_blogs_categories

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  • SoC and IP 415
  • System, PCB, & Package Design  986
  • Verification 1286
  • Cadence Japan 4

  • CFD(数値流体力学) 45
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Blog - Post List

Latest blogs

Breakfast Bytes

ESD Alliance CEO Outlook 2022

Last week was the ESD Alliance CEO Outlook. It was hosted by Keysight (fka Agilent…

Paul McLellan 3 May 2022 • 13 min read
keysight , cadence , ceo outlook , Siemens , ARM , D2S , esd alliance

Verification

How AMBA CHI Specification Has Evolved - CHI-E (r)evolutionary?

We covered CHI specification revisions A to D in my previous article , what about…

MinL 2 May 2022 • 2 min read
Verification IP , Functional Verification , VIP , AMBA , CHI VIP

PCB、IC封装:设计与仿真分析

详解时域瞬态分析技术

本文要点: 所有的物理系统在运行动态中都会表现出一些瞬态行为,电子产品也是如此 瞬态分析技术可以帮助了解不同电气状态之间的转换 当检查测量数据或软件仿真数据时…

Sigrity 2 May 2022 • less than a min read
Chinese blog , 时域 , 仿真 , 中文 , 系统分析 , Sigrity , 信号完整性 , 瞬态

The India Circuit

SemiconIndia 2022 Conference: A First-of-Its-Kind

The Ministry of Electronics and Information Technology (MeitY) organized a unique…

Madhavi Rao 2 May 2022 • 3 min read
Government of India , digital india , National Policy on Electronics , SemiconIndia 2022

Breakfast Bytes

Gabrièle Saucier on the History of IP

Recently, it was D&R's IP-SoC Silicon Valley 2022. The opening keynote was given…

Paul McLellan 2 May 2022 • 4 min read
IP , ip-soc , d&r , semiconductor IP

Computational Fluid Dynamics

Fidelity CFD Overset Meshes to Simulate Rotor Hub Vortex Shedding in Helicopters

Vortex shedding in a helicopter rotor hub can be analyzed and captured precisely…

Veena Parthan 1 May 2022 • 3 min read
CFD , drag prediction , Meshing Monday , vortex shedding , overset meshing , Pointwise , helicopter , rotor hub , Fidelity CFD , engineering , simulation software , NUMECA , Meshing

Breakfast Bytes

Sunday Brunch Video for 1st May 2022

https://youtu.be/TERyp8U7PCY Made at Parker Ranch, Saratoga (camera Carey) Monday…

Paul McLellan 1 May 2022 • less than a min read
sunday brunch

PCB、IC封装:设计与仿真分析

NUMECA、CFD与美洲杯帆船赛

本文翻译自Cadence “Breakfast Bytes Blogs”专栏作者Paul McLellan文章" NUMECA, Computational Fluid…

SDA China 29 Apr 2022 • less than a min read
CFD , Chinese blog , 流体力学 , 计算流体动力学 , 中文 , 系统分析 , NUMECA , 多物理场仿真

Verification

System Verification Scoreboard: Its Role and Partnership with Verification IPs

As discussed in the last installment of the blog, a robust system level scoreboard…

DimitryP 29 Apr 2022 • 1 min read
Verification IP , scoreboard , SoC verification , Hardware Coherency

Breakfast Bytes

April Update: USB-C, Great Place to Work, Intel Fab Tour, DALL-E

It's the last Friday in April already, so time for one of my monthly updates where…

Paul McLellan 29 Apr 2022 • 4 min read
update , USB-C

Analog/Custom Design

Spectre Tech Tips: Using the Spectre Strobe Feature

From time to time, we observe Spectre customers using the maxstep feature for applications…

Stefan Wuensche 28 Apr 2022 • 4 min read
Fast Fourier Transform , ADE Explorer , strobe , Spectre Circuit Simulator , Virtuoso Analog Design Environment , Virtuoso IC6.1.8 , ADE Assembler

Analog/Custom Design

Knowledge Booster Training Bytes — Registrations Open: Enhancing Layout Productivity…

We are going to host a webinar on Virtuoso Layout Pro Training in the upcoming month…

Dishika Majumdar 28 Apr 2022 • 4 min read
Cadence Digital Badges , Cadence Floorplanner , Virtuoso Layout Productivity , Module Generator , Cadence Design Planner , Cadence training , training bytes , Cadence Education Services , Custom IC Design

Computational Fluid Dynamics

Introducing Cadence Fidelity CFD Software

On 19 Apr 2022 we announced Fidelity CFD. As you can imagine, it has dominated my…

John Chawner 28 Apr 2022 • 3 min read
CFD , Computational Fluid Dynamics , fluid dynamics , Fidelity CFD , Mesh Generation

Breakfast Bytes

Syntiant Wins MLPerf TinyML Benchmark (with Help from Tensilica HiFi)

Earlier this month, MLCommons announced the latest round of results for inference…

Paul McLellan 28 Apr 2022 • 4 min read
hifi 5 , mlperf tiny , Tensilica , mlperf

Computational Fluid Dynamics

Computational Fluid Dynamics Helps Marine Life Communicate

CFD simulations can help control noise emitted by cavitation-infected ship propellers…

Veena Parthan 27 Apr 2022 • 4 min read
CFD , Electrification , cavitation , marine , noise pollution , ship propellers , simulation software , electric boats , marine life , under radiated noises , ecological balance

Breakfast Bytes

Linley: AI Moving to the Edge

Last week was the Linley Spring Processor Conference. One change since last year…

Paul McLellan 27 Apr 2022 • 6 min read
hopper , deep learning , Linley , neural network , AI

System, PCB, & Package Design 

What's New in Clarity 3D Solver: Advancing In-Design EM Analysis

Increase both performance and capacity for chip, package, and PCB EM analysis with…

Sherry Hess 27 Apr 2022 • less than a min read

System, PCB, & Package Design 

Silicon Chips: EM Simulation for Passive Circuit Analysis & Model Development

Modern electrical system design for 5G wireless systems and connected devices for…

Sherry Hess 27 Apr 2022 • less than a min read

System, PCB, & Package Design 

3D-IC: System-Level Electrical and Thermal Challenges

3D-ICs (the latest technology for fitting more functionality onto a smaller chip…

Sherry Hess 27 Apr 2022 • less than a min read
3DIC , in-design analysis , Thermal Integrity
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