• Skip to main content
  • Skip to search
  • Skip to footer
Cadence Home
  • This search text may be transcribed, used, stored, or accessed by our third-party service providers per our Cookie Policy and Privacy Policy.

  1. Blogs
  2. Community Forums
  3. Cadence Community
Cadence Community
  • This search text may be transcribed, used, stored, or accessed by our third-party service providers per our Cookie Policy and Privacy Policy.

  • Site
  • Search
  • User
Find Other Members ►
Subscriptions
Get email delivery of the Cadence blog (individual posts).
  • Twitter
  • Facebook
  • LinkedIn
  • Google+

Community


Blogs
Forums
Resources

Latest Forum Posts

Visit the User Forums »

Latest Blog Posts

  • Last Week at Fidelity CFD

    Computational Fluid Dynamics: Last Week at Fidelity CFD

    John Chawner
    John Chawner
    While a large contingent of Fidelity CFD team members are at the AIAA SciTech Forum this week, let's take a look back at what happened here last week. This post's featured image is a blast from the past of flow through a valve. (Image created...
    • 23 Jan 2023
  • Design Enablement of 2D/3D Thermal Analysis and 3-Die Stack

    Breakfast Bytes: Design Enablement of 2D/3D Thermal Analysis and 3-Die Stack

    Paul McLellan
    Paul McLellan
    At CadenceLIVE Europe back in November, one of the presentations was by Mohamed Naeim titled Design Enablement of 2D/3D Thermal Analysis and 3-Die Stack. Mohamed is officially a Cadence employee, but he's also a Cadence PhD resident at imec ...
    • 23 Jan 2023
  • 5 Small Features for Easy Meshing in Fidelity Pointwise

    Computational Fluid Dynamics: 5 Small Features for Easy Meshing in Fidelity Pointwise

    Veena Parthan
    Veena Parthan
    The big powerful features such as unstructured quadrilateral surface meshing, unstructured hexahedral layer extrusion in the anisotropic tetrahedral extrusion (T-Rex) technique, and tetrahedral mesh clustering sources often overshadow the small yet formidable features in Fidelity Pointwise. This blog enlists the top five small features for easy meshing in Fidelity Pointwise.
    • 23 Jan 2023
  • Sunday Brunch Video for 22nd January 2023

    Breakfast Bytes: Sunday Brunch Video for 22nd January 2023

    Paul McLellan
    Paul McLellan
    https://youtu.be/ARCzcdPvLZg Made at Castle Rock State Park (camera Carey) Previous Monday: CES 2023 Trends Monday: Martin Luther King Day (no post) Tuesday: DesignCon 2023 Preview Wednesday: Improving RISC-V Processor Quality with Verifica...
    • 22 Jan 2023
  • ST's Experience with Cadence Cerebrus

    Breakfast Bytes: ST's Experience with Cadence Cerebrus

    Paul McLellan
    Paul McLellan
    At CadenceLIVE Europe back in Thanksgiving week, one of the presentations was by Olivier Uliana of STMicroelectronics titled Cerebrus PPA Optimization on the Next-Generation High-End Microcontroller CPU Core. In case you've forgotten what Cadence...
    • 20 Jan 2023
  • AMD Is Designing Their EPYC Server Processors with the Dynamic Duo

    Corporate News: AMD Is Designing Their EPYC Server Processors with the Dynamic Duo

    Corporate
    Corporate
    AMD are known for creating some of the world’s most advanced processors. AMD’s EPYC server processors represent a big step forward for high-performance computing, cloud, and enterprise workloads. When it comes to the emulation stage of th...
    • 19 Jan 2023
  • Malcolm Penn: “We Are Stoking Capacity Just When We Don’t Need It”

    Breakfast Bytes: Malcolm Penn: “We Are Stoking Capacity Just When We Don’t Need It”

    Paul McLellan
    Paul McLellan
    On Tuesday this week, Malcolm Penn of Future Horizons gave one of the three annual presentations on the outlook for the semiconductor industry. I last wrote about a presentation by Malcolm what feels like "recently" but was, in fact, in 2021. That po...
    • 19 Jan 2023
  • Start Your Engines: Running Post-Layout Mixed-Signal Simulations with a More Complex Configuration

    Analog/Custom Design: Start Your Engines: Running Post-Layout Mixed-Signal Simulations with a More Complex Configuration

    Qingyu Lin
    Qingyu Lin

    Cadence®︎ Spectre®︎ With the DSPF-in-the-middle feature, designers can easily set up complex configurations in the Hierarchy Editor (HED) and run a post-layout mixed-signal simulation with just a few clicks. View this blog to know more.

    • 19 Jan 2023
  • FMEDA-Driven SoC Design of Safety-Critical Semiconductors

    SoC and IP: FMEDA-Driven SoC Design of Safety-Critical Semiconductors

    Robert
    Robert
    Written by Francesco Lertora and Robert Schweiger 1.1      Introduction

    The growing complexity of electronics in modern cars is driving the automotive industry to adopt even more stringent processes throughout the supply chain. The lack of tools and methodologies to enforce a traceable safety lifecycle and exchange of safety-relevant information has created the need for an integrated design flow that addresses the safety requirements…

    • 18 Jan 2023
  • What Makes a Next-Generation Debug Solution?

    Verification: What Makes a Next-Generation Debug Solution?

    Rich Chang
    Rich Chang

    For the past few decades, design and verification technology have made great progress. More sophisticated designs are verified with faster simulation and emulation. However, the debug is pretty much the same as 20 years ago. The most bothersome thing for engineers is why there’s no way to automate the process. What engineers typically do is, check the log file and see if there are any errors from verification tools such…

    • 18 Jan 2023
  • Spectre Tech Tips: Dynamically Changing Spectre X Solver Settings

    Analog/Custom Design: Spectre Tech Tips: Dynamically Changing Spectre X Solver Settings

    Stefan Wuensche
    Stefan Wuensche

    Spectre APS supports dynamically changing errpreset or reltol during a transient simulation. This feature is used by advanced Spectre users to optimize simulation performance when different time windows of the simulation have different accuracy requirements. The use model for this feature is the following:

    • tr1 tran stop=10u param=errpreset param_vec=[0 liberal 2u moderate]

    The errpreset parameter is not available in…

    • 18 Jan 2023
  • Improve Regression Throughput and Find Bugs at Pace

    Verification: Improve Regression Throughput and Find Bugs at Pace

    Vinod Khera
    Vinod Khera

    Xcelium helps achieve same coverage 5X faster

    Scaling chip size and increasing functionality over SoCs has increased complexity and verification time. Verification teams are concerned about the bugs that may have slipped to silicon earlier and their discovery rate. Moreover, completing the verification and achieving the desired coverage is tricky. It looks arduous to complete the verification and meet the time constraints, especially when the specifications change…

    • 18 Jan 2023
  • Improving RISC-V Processor Quality with Verification Standards and Advanced Methodologies

    Breakfast Bytes: Improving RISC-V Processor Quality with Verification Standards and Advanced Methodologies

    Paul McLellan
    Paul McLellan
    At the RISC-V Summit in December, there were presentations halfway between a keynote and a technical session. known as RISC-V Spotlights. These were presented to the entire group of attendees but were not blessed with the keynote title. Maybe this is...
    • 18 Jan 2023
  • Automating Data Coherency and Performance Testing of High-Speed SoCs with CXL Interfaces

    Verification: Automating Data Coherency and Performance Testing of High-Speed SoCs with CXL Interfaces

    Sangeeta Soni
    Sangeeta Soni

    2023 is here, and technology trends around Compute Express Link (CXL) and the next generation of AMBA protocols (CHI-E/F) are getting more traction. The biggest challenge of today is the complexity of handling enormous data flow owning to AI, ML, and deep learning applications. To keep up with the pace, new generation interfaces introduce specialized semantics catering to memory disaggregation, cache consistency, techniques…

    • 18 Jan 2023
  • Training Insights - What's Your Weekend Plan? How About an Interactive Tour of the Genus Synthesis Solution World?

    Digital Design: Training Insights - What's Your Weekend Plan? How About an Interactive Tour of the Genus Synthesis Solution World?

    Neha Joshi
    Neha Joshi

    Well, we know you are busy, but it's time to develop your expertise in the synthesis domain with the Genus Synthesis Solution. How? You can plan to complete the Genus Synthesis Solution with Stylus Common UI training.

    The ultimate goal of the Cadence® Genus Synthesis Solution is very simple: deliver the best possible productivity during register-transfer-level (RTL) design and the highest quality of results (QoR)…

    • 18 Jan 2023
  • Training Insights – Webinar – Transforming your Timing Signoff Experience with Tempus SSV221: Recording Now Available

    Digital Design: Training Insights – Webinar – Transforming your Timing Signoff Experience with Tempus SSV221: Recording Now Available

    sakshin
    sakshin
    This blog post describes the latest innovations in the Cadence®︎ Tempus™︎ Timing Signoff Solution SSV221 Release through a recoded webinar session.
    • 18 Jan 2023
  • DesignCon 2023 Preview

    Breakfast Bytes: DesignCon 2023 Preview

    Paul McLellan
    Paul McLellan
    Coming up at the end of this month is DesignCon, obviously not to be confused with the Design Automation Conference which will be in July as usual. The focus of DesignCon is more on designing systems, meaning printed circuit boards, advanced packagin...
    • 17 Jan 2023
  • Why Use T-Rex Hybrid Meshing?

    Computational Fluid Dynamics: Why Use T-Rex Hybrid Meshing?

    Veena Parthan
    Veena Parthan
    As a CFD practitioner, have you experienced difficulty generating meshes in regions where the flow changes rapidly, especially along the boundary layer or wall boundary? At your rescue is the Fidelity Pointwise T-Rex meshing for near-body or boundary layer meshing with special handling of symmetry boundaries.
    • 16 Jan 2023
  • USB3 Gen T Tunneling Over USB4

    Verification: USB3 Gen T Tunneling Over USB4

    Sanjeet Kumar
    Sanjeet Kumar
    USB Promoter Group recently released USB4 Version 2.0 and this updated specification extends USB4 speed and data protocol performance, enabling manufacturers to develop products that can deliver up to 80 Gbps of data performance over the USB Type-C&r...
    • 16 Jan 2023
  • Cadence India’s Flagship CSR Initiative, the Cadence Scholarship Program, Recognized

    The India Circuit: Cadence India’s Flagship CSR Initiative, the Cadence Scholarship Program, Recognized

    Asim Khan
    Asim Khan
    Cadence India’s flagship Corporate Social Responsibility (CSR) initiative, the Cadence Scholarship Program, has won the prestigious “CSR Times Awards 2022” in the “Education” category. The CSR Times Awards is o...
    • 15 Jan 2023
  • Announcement of the Availabilty of Verification Education Kit

    Academic Network: Announcement of the Availabilty of Verification Education Kit

    Anton Klotz
    Anton Klotz
    www.youtube.com/watch Four years ago, I wrote a blog, “Status of Verification Education in Academia,” where I stated that “the need for verification is increasing [and] the demand for verification experts is rising.” Well, the...
    • 13 Jan 2023
  • DDR5 DIMM Design and Verification Considerations

    Verification: DDR5 DIMM Design and Verification Considerations

    Shyam Sharma
    Shyam Sharma

    DDR5 is the latest generation of the DDR server memory capable of supporting data rates of up to 8800 Mbps which is quite a leap over previous generations of DDR memories. It is used in a wide variety of applications with a huge server, and the data center market is a key driver behind the adoption of the DDR5-based memory systems. As systems are moving tow ards more CPU cores, higher bandwidth, and more capacity, DDR5…

    • 13 Jan 2023
  • PCB設計/ICパッケージ設計: Ascent: Training Insights: Allegro System Captureでデザインバリアント(仕向け設定)を管理する

    SPB Japan
    SPB Japan
    ボードのアセンブリは、PCB 開発プロセスにおいて最後の重要なステップのひとつです。 パーツを慎重に選択することは、特に、アセンブリ用に最終パーツの情報を送信する前において最も重要です。 この段階では、ちょっとしたパーツ変更でさえ、製品のコストや品質に大きな影響を与える可能性があります。 ここである例を見てましょう。 顧客 A が 512GB のメモリを搭載した電子デバイスを必要としており、別の顧客 B が1024GB のデジタル メモリを搭載した同じデバイスを必要としているとします。 では、こ...
    • 13 Jan 2023
  • UCIe: Enabling the Chiplet-Based Ecosystem

    Verification: UCIe: Enabling the Chiplet-Based Ecosystem

    JHarshit
    JHarshit

    Universal Chiplet Interconnect Express (UCIe) is a novel specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level.

    What Is a Chiplet?

    A chiplet is a tiny integrated circuit (IC) with a well-defined specific functionality. One can relate this to LEGO building blocks for creating large structures.

    Why Do We Need a Chiplet…

    • 12 Jan 2023
  • Introduction to Embedded DisplayPort (eDP) version 1.5

    Verification: Introduction to Embedded DisplayPort (eDP) version 1.5

    tfox
    tfox

    Embedded DisplayPort 1.5 (eDP 1.5) is an interface standard that is based on the DP 2.0 (DP standard), and it is designed to transport video between the system host, i.e., GPU, and device, i.e., display panel. It supports selective DP 2.0 features and additional features that are designed to conserve power. The diagram below, which is taken from the eDP 1.5 standard, shows a simplified eDP implementation.

    Some of the…

    • 12 Jan 2023
<>
Cadence Guidelines

Community Guidelines

The Cadence Design Communities support Cadence users and technologists interacting to exchange ideas, news, technical information, and best practices to solve problems and get the most from Cadence technology. The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information. By accessing, contributing, using or downloading any materials from the site, you agree to be bound by the full Community Guidelines.

© 2025 Cadence Design Systems, Inc. All Rights Reserved.

  • Terms of Use
  • Privacy
  • Cookie Policy
  • US Trademarks
  • Do Not Sell or Share My Personal Information