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Featured

Corporate News

Fortune & Great Place To Work Name Cadence to 2025 World’s Best Workplaces List

Great Place To Work® and Fortune magazine have honored Cadence as one of the Fortune…

Corporate
Corporate 13 Nov 2025 • 2 min read
news story , Culture , featured

Corporate News

Spectre FX Simulator Cuts Intrinsic Semi’s Memory Verification Time by 4X

Intrinsic Semiconductor Technologies, a company transforming the semiconductor industry…

Corporate
Corporate 11 Nov 2025 • 2 min read
newstory , featured , spectre fx , Instrinsic Semi , verification

Corporate News

Cadence Welcomes ChipStack

ChipStack, a leading startup providing agentic AI solutions for chip verification…

Corporate
Corporate 10 Nov 2025 • 1 min read
featured , agentic ai , Xcelium Logic Simulator , AI-Driven Verification

SoC and IP

The Power of Shifting Left: Cadence Accelerating Innovation with Arm

In semiconductor design, projects are remembered for their extremes—legendary successes…

Arif Khan
Arif Khan 7 Nov 2025 • 3 min read
ucie , xcellium , IP , featured , PHY
cdns - all_blogs_categories

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  • System, PCB, & Package Design  992
  • Verification 1293
  • Cadence Japan 5

  • CFD(数値流体力学) 45
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  • PCB、IC封装:设计与仿真分析 136
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  • データセンター 7

  • Whiteboard Wednesdays 253
Blog - Post List
Latest blogs

PCB、IC封装:设计与仿真分析

2021年度网课 I PCB系统设计——从原理图到投产

连接器不匹配、板间信号连接错误、设计需求传递失误…… 此类问题的发生,会导致设计前后端返工,严重影响产品上市时间,造成人力物力损失,这是项目团队及设计工程师最不希望发生的事情…

TeamAllegro 7 May 2021 • less than a min read
System Capture , Chinese blog , 系统设计 , PCB设计 , 中文 , 直播网课 , online training , Allegro

PCB、IC封装:设计与仿真分析

升级到Allegro 17.4的10大理由

工欲善其事,必先利其器! 为何不能错过Cadence Allegro 17.4 ?十大理由告诉你。 更加自动化的超实用功能助力打通智能电子设计任督二脉。 1. 整合前后端走线规则管理器…

TeamAllegro 7 May 2021 • less than a min read
Chinese blog , 17.4 , allegro 17.4 , PCB设计 , 中文 , Allegro , 产品升级

PCB、IC封装:设计与仿真分析

六层PCB的漏斗设计

电气工程师尼古拉·特斯拉(Nikola Tesla)曾声称自己发明了一种带电粒子束投影仪——或者用科幻术语来说——离子炮(ion cannon)。这是一种防御性武器…

TeamAllegro 7 May 2021 • less than a min read
PCB , Chinese blog , 柔性电路 , PCB设计 , 中文 , 多层电路 , Allegro

Analog/Custom Design

Virtuoso Video Diary: Knowledge Booster Training Bytes - Part 7: The Virtuoso ADE…

This blog shows how to efficiently use the Virtuoso ADE Assembler and Virtuoso ADE…

Parula 7 May 2021 • 4 min read
blended , ADE Explorer , Explorer , training , Cadence training , digital badges , training bytes , Virtuoso , Analog IC Design videos , Cadence certified , Virtuoso Video Diary , Custom IC Design , online training , Custom IC , Assembler , ADE Assembler

Computational Fluid Dynamics

This Week in CFD

It's Friday which means it's time for that weekly roundup of news from the CFD world…

John Chawner 7 May 2021 • less than a min read
CFD , Pointwise , fine/marine , Computational Fluid Dynamics , NUMECA , Mesh Generation , Meshing

Computational Fluid Dynamics

Hello, CFD Meshing World!

For the third time*, I find myself writing the obligatory, "Hello, World!" first…

John Chawner 6 May 2021 • 2 min read
CFD , Pointwise , Computational Fluid Dynamics , NUMECA , Mesh Generation , Meshing

Digital Design

What’s Inside the GUI-Based Timing Report in Genus? Want to Explore?

Timing closure is one of the most crucial steps of a digital design. Therefore, to…

Neha Joshi 6 May 2021 • 1 min read
report , Genus , gui , timing debug , Timing Optimization , debug report , Synthesis

Breakfast Bytes

Sunday Brunch Video for 2nd May 2021

https://youtu.be/1HEd6JCriCQ Made in Groveland CA (camera Carey Guo) Monday: Package…

Paul McLellan 2 May 2021 • less than a min read
sunday brunch

System, PCB, & Package Design 

IC Packagers: Analyze, Simulate, and Resolve Signal Integrity Issues Using In-Design…

In today's ever-shrinking IC Package design cycles, it is almost imperative that…

avijeet 1 May 2021 • 3 min read
IDA , IC Packaging and SiP , IC Packagers , Allegro Package Designer , 17.4-2019 , PCB design

中文技术专区

向SiP过渡,EDA大有可为!

芯片设计可谓是人类历史上最细微也是最宏大的工程。它要求把上千亿的晶体管集成到不到指甲盖大小的面积上,这其中 EDA 工具的作用不可或缺。它于芯片设计就如同编辑文档需要的…

FormerMember 29 Apr 2021 • less than a min read
SiP , chiplet , 系统级封装 , thermal

Breakfast Bytes

Offtopic: Miniatur Wunderland

Tomorrow and Monday are Cadence Global Holidays. Of course, May 1 is a holiday anyway…

Paul McLellan 29 Apr 2021 • 4 min read
offtopic

Verification

What Disruptive Changes to Expect from PCI Express Gen 6.0

PCIe (Peripheral Component Interconnect Express) has long been the backbone of complex…

Claire Ying 28 Apr 2021 • 3 min read
SoC verification , Functional Verification , Modeling , verification

Breakfast Bytes

Arm V9A

Yesterday, I wrote about rapid adoption kits (RAKs) for the latest Arm server-class…

Paul McLellan 28 Apr 2021 • 4 min read
isa , arm v9 , ARM

カスタムIC/ミックスシグナル

Virtuoso Meets Maxwell: ICパッケージングプロセスのためのダイとBGAパッケージ間の接続の作成

'Virtuoso Meets Maxwell' はVirtuoso RFソリューションとVirtuoso MultiTechの機能及びその潜在能力の紹介を目的としたブログの連載です…

Custom IC Japan 27 Apr 2021 • less than a min read
IC , package , Footprint , Virtuoso Meets Maxwell , Virtuoso RF Solution , Package Design in Virtuoso , Allegro Package Designer Plus , BGA , die , OrbitIO , SiP Layout Option , ICADVM20.1 , japanese blog , Ball , Custom IC , bump

Breakfast Bytes

Rapid Adoption of the Arm Server-Class Processors

Arm has been moving from its foundational base in mobile into the data center, with…

Paul McLellan 27 Apr 2021 • 3 min read
featured post , neoverse-v1 , neoverse , verification suite , digital full flow , neoverse-n2 , ARM

System, PCB, & Package Design 

ASCENT: Finding the Right Parts with Unified Search

Some people say that finding the right components for a design is the most time-consuming…

Rachna2018 27 Apr 2021 • 4 min read
System Capture , 17.4 , cadence , Dashboard , Search , logical design , LIVE BOM , logic capture , 17.4-2019 , PCB design , Allegro System Capture , Unified Search , New part request , ASCENT , BOM , Schematic , Allegro

Analog/Custom Design

Spectre Tech Tips: Introducing Electrothermal Simulation

Understanding the thermal performance of integrated circuits has been essential to…

Fred Yang 26 Apr 2021 • 3 min read
Electrothermal simulation , Spectre , Custom IC Design , Legato Reliability

Computational Fluid Dynamics

Thermal Analysis of a Hardware Blade System

Here's a video titled Thermal Analysis of a Hardware Blade System. The "blade system…

Paul McLellan 26 Apr 2021 • less than a min read
CFD , celsius , protium x1

Breakfast Bytes

Package Assembly Design Kits

At the recent IMAPS conference, Cadence's John Park presented on Package Assembly…

Paul McLellan 26 Apr 2021 • 3 min read
system in package , imaps , packaging , chiplet , adk , PDK
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