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Featured

Corporate News

The Three Phases of AI Adoption

Artificial intelligence is often discussed as if the industry is moving through a…

Corporate
Corporate 25 Jun 2026 • 6 min read
featured , infrastructure ai , agentic ai , physical ai , sciences ai

Corporate News

Finding What Truly Moves You: Honoring Alberto Sangiovanni-Vincentelli

"Finding what truly moves you is happiness. Success is measured in the lasting impact…

Corporate
Corporate 24 Jun 2026 • 2 min read
featured , EDA , Alberto Sangiovanni-Vincentelli , UC Berkeley

Corporate News

Accelerating Drug Discovery with Agentic AI and Computational Science

By Louis Culot, corporate vice president and general manager, Cadence Molecular Sciences…

Corporate
Corporate 23 Jun 2026 • 3 min read
drug discovery , Cadence Molecular Sciences , featured , agentic ai , NVIDIA

Corporate News

Honda + Cadence = Physical AI (part 2): Where Physical AI Will Be Won

Hello everyone, I'm Atsushi Ogawa, Center Head of HGR. The real challenge of physical…

Corporate
Corporate 22 Jun 2026 • 8 min read
featured , physical ai , HGR , AI , Honda
cdns - all_blogs_categories

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  • SoC and IP 435
  • System, PCB, & Package Design  1016
  • Verification 1326
  • Cadence Japan 18
  • Physical Systems Simulation 24

  • CFD(数値流体力学) 45
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  • カスタムIC/ミックスシグナル 199
  • PCB、IC封装:设计与仿真分析 136
  • PCB解析/ICパッケージ解析 44
  • PCB設計/ICパッケージ設計 61
  • RF /マイクロ波設計 45
  • Spotlight Taiwan 64
  • The India Circuit 93
  • 定制IC芯片设计 79
  • データセンター 7

  • Whiteboard Wednesdays 253
Blog - Post List
Latest blogs

Spotlight Taiwan

超大規模資料中心、行動通訊與汽車 推動先進製程節點不斷創新 - 摩爾定律仍加速前行!

原文作者: Cadence資深副總裁暨數位與簽核事業群總經理滕晉慶(Chin-Chi Teng) 原文出處: https://www.linkedin.com/posts…

candyyu 7 Jun 2021 • less than a min read
3nm , Hyperscalers , Digital Implementation , taiwanese blog

Breakfast Bytes

Hardware Hacking Party Tricks

Toward the end of April, Black Hat ran a webinar Hacking Party Tricks: Techniques…

Paul McLellan 7 Jun 2021 • 6 min read
security , glitching , blackhat , JTAG

Verification

Webinar: Using e Reflection

Join Cadence Training and Software Architect Efrat Shneydor for this free technical…

teamspecman 6 Jun 2021 • 1 min read
Specman , Specman e , training , webinar , reflection

Breakfast Bytes

Sunday Brunch Video for 6th June 2021

https://youtu.be/sqEzhpQZmbo Made on my dining table (camera me) Monday: Memorial…

Paul McLellan 6 Jun 2021 • less than a min read
sunday brunch

Breakfast Bytes

A Year of Breakfasts 2021

This year's Breakfast Bytes annual is out. It is titled A Year of Breakfasts 2021…

Paul McLellan 4 Jun 2021 • 1 min read
a year of breakfasts 2021 , breakfast bytes book , Breakfast Bytes

Computational Fluid Dynamics

Pointwise V18.4 R4 Now Available for Download and Production Use

As the title says, Pointwise Version 18.4 R4 is now available for download and production…

John Chawner 3 Jun 2021 • 1 min read
CFD , Pointwise , Computational Fluid Dynamics , Mesh Generation , Meshing

Analog/Custom Design

Start Your Engines: Modeling Current-Based Port Connections between Electrical and…

In a mixed-signal simulation, the electrical signal modules and real number modeling…

Qingyu Lin 3 Jun 2021 • 5 min read
R2E conversion , real number modeling , AMS , AMS Designer , Start Your Engines , E2R , Mixed-Signal , mixed-signal verification

Breakfast Bytes

TSMC: Advanced Technology for Smartphone and HPC Platforms

Yujun Li, TSMC's director of business development for high-performance computing…

Paul McLellan 3 Jun 2021 • 3 min read
5G , n5 , n5hpc , n3 , TSMC , HPC , n7 , n7hpc

定制IC芯片设计

Virtuoso Meets Maxwell: 从系统的角度思考—— 行业领先的IC与IC封装设计/验证工具间互操作性的优势

当下大多数的模拟,射频和混合信号设计都要求在不同衬底工艺上集成多颗IC,以达到所需的性能。异构元件集成方法可以帮助设计师实现单片SoC不容易实现的设计结果。与此同时…

danbaldwin 2 Jun 2021 • less than a min read
Chinese blog , IC Packaging , Virtuoso Meets Maxwell , Virtuoso RF Solution , Mixed-Signal , Virtuoso Analog Design Environment , Virtuoso , Spectre , Allegro

System, PCB, & Package Design 

BoardSurfers: Voiding Text in Copper Shapes

Almost every PCB design includes different types of shapes, mainly for ground and…

Sanjiv Bhatia 2 Jun 2021 • 3 min read
PCB , 17.4 , BoardSurfers , PCB Editor , 17.4-2019 , PCB design , Allegro PCB Editor , Allegro

Breakfast Bytes

CEO Outlook: "Let's Take Advantage of Our Industry Being in the Spotlight"

The Electronic System Design Alliance CEO Outlook took place on May 16. Bob Smith…

Paul McLellan 2 Jun 2021 • 13 min read
ESDA , semi , ceo outlook , esd alliance

カスタムIC/ミックスシグナル

Virtuoso Meets Maxwell: Clarity 3Dソルバーでのシミュレーション用にポートを設定する

Virtuoso Meets Maxwell はVirtuoso RFソリューションとVirtuoso MultiTechの機能及びその潜在能力の紹介を目的としたブログの連載です…

Custom IC Japan 1 Jun 2021 • less than a min read
Virtuoso Meets Maxwell , Virtuoso RF Solution , Electromagnetic analysis , ICADVM20.1 , japanese blog , Clarity 3D Solver , Custom IC Design , Virtuoso Layout Suite EXL

Verification

AMBA 5 ACE/AXI Specification Updates and Their Support in Cadence ACE/AXI VIP

As discussed in the previous blog, the AMBA® 5 specification updates introduced several…

DimitryP 1 Jun 2021 • 3 min read
amba5 , ACE5 , AXI5 , Funcional Verification , AMBA Verification IP , System Verification Scoreboard

System, PCB, & Package Design 

CFD: It's More Than an Acronym - Learn More at CadenceLIVE

Excuse me, sir. Are you lost? That's what you might be thinking. Why is this guy…

John Chawner 1 Jun 2021 • 1 min read
CFD , Pointwise , Computational Fluid Dynamics , NUMECA

Breakfast Bytes

Countdown to TSMC Technology Symposium: 7nm, 5nm, 3nm, June 1

Today it is the TSMC 2021 Online North America Technology Symposium (tomorrow for…

Paul McLellan 1 Jun 2021 • 3 min read
n4 , n3 , TSMC , TSMC Technology Symposium , custom/analog flow , digital full flow

Analog/Custom Design

Virtuoso Meets Maxwell: Defining Ports in EMX Planar 3D Solver

Fast and accurate electromagnetic simulation is becoming critical in a growing number…

kfullerton 31 May 2021 • 6 min read
VRF , Virtuoso Meets Maxwell , Virtuoso RF Solution , Virtuoso RF , Electromagnetic analysis , EMX , EM Analyis , RF design , ICADVM20.1 , Custom IC Design , Virtuoso Layout Suite EXL

PCB、IC封装:设计与仿真分析

如何在IC封装设计中告别锐角问题?

本文作者:Tyler Lockman,Cadence Software Architect,于加拿大卡尔顿大学获计算机科学学士学位后,在Cadence Allegro产品部门工作超过20年…

TeamAllegro 28 May 2021 • less than a min read
PCB , IC , Chinese blog , 17.4 , APD , Allegro Package Designer Plus , PCB设计 , 中文 , IC封装 , 锐角 , Allegro

Digital Design

Voltus Voice: Demystifying ESD—Charting Your Way through Voltus ESD Reports

In the concluding blog of our "Demystifying ESD" series, we walk you through the…

Vijetha 28 May 2021 • 6 min read
Silicon Signoff and Verification , electromigration , Voltus IC Power Integrity Solution , ESD reports , electrostatic discharge , current density , Power Integrity , Innovus , clamp , bump

Digital Design

SSV 21.1 Base Release Now Available

The Silicon Signoff and Verification (SSV) 21.1 release is now available for download…

SSV Release Team 28 May 2021 • 3 min read
Celsius Thermal Solver , Temperature Map , Voltus IC Power Integrity Solution , 3nm , Power Integrity , Power Targets , silicon signoff , Tempus Timing Signoff Solution , Extreme Modeling
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