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Corporate News

Cadence Certifies AI-Driven Reference Flows for Intel 18A-P and Intel 14A

The expanded Cadence-Intel Foundry collaboration delivers silicon-proven digital…

Corporate
• 3 min read
DAC , Design IP , featured , DAC 2026 , AI-Driven Design

Corporate News

The Autonomous Chip-to-System Engineer Has Arrived

How Cadence, in collaboration with NVIDIA, is building the industry's first silicon…

Corporate
• 4 min read
AuraStack AI Super Agent , DAC , featured , agentic ai , NVIDIA

Corporate News

Cadence’s Agentic AI Design Vision Takes Center Stage at DAC

AI infrastructure demands are changing what semiconductor design must solve. The…

Corporate
• 4 min read
AuraStack AI Super Agent , featured , agentic ai , DAC 2026 , ChipStack AI Super Agent

Corporate News

AI Infrastructure Starts Beyond the Chip

Why Advanced Packaging and PCB Design Have Become the Next Frontier of Innovation…

Corporate
• 8 min read
chip , featured , AI infrastructure , agentic ai , packaging
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Latest blogs

Breakfast Bytes

Syntiant Wins MLPerf TinyML Benchmark (with Help from Tensilica HiFi)

Earlier this month, MLCommons announced the latest round of results for inference…

• 4 min read
hifi 5 , mlperf tiny , Tensilica , mlperf

Computational Fluid Dynamics

Computational Fluid Dynamics Helps Marine Life Communicate

CFD simulations can help control noise emitted by cavitation-infected ship propellers…

• 4 min read
CFD , Electrification , cavitation , marine , noise pollution , ship propellers , simulation software , electric boats , marine life , under radiated noises , ecological balance

Breakfast Bytes

Linley: AI Moving to the Edge

Last week was the Linley Spring Processor Conference. One change since last year…

• 6 min read
hopper , deep learning , Linley , neural network , AI

System, PCB, & Package Design 

What's New in Clarity 3D Solver: Advancing In-Design EM Analysis

Increase both performance and capacity for chip, package, and PCB EM analysis with…

• less than a min read

System, PCB, & Package Design 

Silicon Chips: EM Simulation for Passive Circuit Analysis & Model Development

Modern electrical system design for 5G wireless systems and connected devices for…

• less than a min read

System, PCB, & Package Design 

3D-IC: System-Level Electrical and Thermal Challenges

3D-ICs (the latest technology for fitting more functionality onto a smaller chip…

• less than a min read
3DIC , in-design analysis , Thermal Integrity

System, PCB, & Package Design 

All Systems Go! Find and Fix Thermal PCB Problems Sooner Than Later

Electrothermal co-simulation—understanding the implications (intended or otherwise…

• 1 min read

RF Engineering

RF/Microwave System Design Trends

David Vye of Cadence and Dave Maliniak of Microwaves & RF magazine discuss the Cadence…

• less than a min read
RF , featured , awr

RF Engineering

In-Design EM Analysis for Microwave/RF Design and Verification Workflows

3D finite element method (FEM) and 3D planar method of moments (MoM) have become…

• less than a min read
in-design analysis , electromagnetic , microwave design

System, PCB, & Package Design 

All Systems Go! Ensuring Power Integrity—Explore, Design, and Verify

When designing an electronic system, ensuring power integrity (PI) is all about making…

• less than a min read

System, PCB, & Package Design 

All Systems Go! - Bridging the Gap Between Design and Analysis

Electronic designs are increasing in capacity, complexity, and performance.  Of course…

• less than a min read

System, PCB, & Package Design 

High-Tech Everything

Is there any industry left in today’s automated world that does not embrace some…

• 1 min read

Breakfast Bytes

Asianometry

If you like to take the semiconductor and EDA industries in video form, then one…

• 2 min read
asianometry , YouTube

Academic Network

Tensilica Education Kit Available Now

After the big success of the VLSI Fundamental: A Practical Approach Education Kit…

• 1 min read
Cadence Academic Network , Education Kits , Tensilica University Program , Tensilica

Computational Fluid Dynamics

Simulating S-CO2 Power Cycles with Fidelity Pointwise

Flow transitions in the S-CO2 Brayton cycle can be easily modeled with high resolution…

• 2 min read
CFD , turbomachinery , Meshing Monday , Pointwise , Brayton Cycle , Supercritical Carbon Dioxide , S-CO2 Cycle , Fidelity CFD , engineering , simulation software , NUMECA , Meshing

Breakfast Bytes

DesignCon: Google on AI for Non-AI People

At the recent DesignCon, one of the keynotes was given by Google's Laurence Moroney…

• 5 min read
DesignCon , google , neural networks , designcon 2022 , AI

Breakfast Bytes

Earth Day: What Will It Take to Get to Carbon Neutrality by 2050?

It's Earth Day today. So let's take a look at what it would take to make everyone…

• 9 min read
solar , wind , earth day , energy

Verification

AMBA Distributed Translation Interface (DTI) for Arm System MMU

In ARM MMU-based systems, DTI protocol defines a standard way to communicate with…

• 1 min read
AMBA-DTI , AMBA VIP , AMBA Verification IP

カスタムIC／ミックスシグナル

Virtuosity: カスタムIC設計フロー／手法 – 回路図のキャプチャと回路シミュレーション

カスタム／ミックスドシグナル設計における現在の課題は、高速でシリコン精度の高い手法を持つことです。このブログ・シリーズでは、カスタムICの設計フローと手法の段階についてご紹介します…

• 1 min read
Virtuoso Schematic Editor , Analog Design Environment , custom/analog , ADE Explorer , Explorer , Analog Simulation , analog , Virtuoso Visualization and Analysis XL , ADE , Virtuoso Analog Design Environment , Spectre , Schematic Editor , ViVA , Virtuosity , ICADVM20.1 , AMS simulation , mixed signal , analog design , usability , japanese blog , Custom IC Design , Custom IC , IC6.1.8 , Assembler , Schematic , custom design technology , ADE Assembler
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