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Latest Blog Posts

  • CFD(数値流体力学): チュートリアル火曜日 - メッシングを学ぼう

    CFD Japan
    CFD Japan
    今日はただの火曜日ではなく、チュートリアルの公開日です。 我々のチュートリアルビデオをご存じですか? 毎週火曜日は、PointwiseのYouTubeチャンネルで新しいビデオを公開しています。   これはただのビデオではありません。たった3分でメッシュ生成ソフトウェアの機能を知ることができるのです。 以下のビデオでは、内部に穴のある非構造サーフェスメッシュ(ドメイン)を作成する方法を短時間で学ぶことができます。この例では、翼型とシミュレーション空間の外側の境界との間の領域をメッシングす...
    • 15 Nov 2021
  • CFD(数値流体力学): 今週のCFD

    CFD Japan
    CFD Japan
    今週のCFDニュースには、今週の画像と今週のアプリケーションの両方が掲載されていますが、ご自身で結論を出してください。まだまだオンラインイベントが多いですが、AIAA SciTech 2022はオンラインと対面式のイベントになりそうで嬉しいですね。サンディエゴでお会いしましょう。たくさんの決算情報、たくさんのメッシュの仕事。さらに、AI、GPU、量子コンピューティングの三位一体。ここに示しているのは、CFDを風力タービンの設置に応用した典型的な例で、地形上の乱流強度を示しています。黒い点は、個々...
    • 15 Nov 2021
  • System, PCB, & Package Design : BoardSurfers: Training Insights: Tips to Zoom and Pan Efficiently in Allegro PCB Editor

    Taanya
    Taanya
    While designing a layout within Allegro® PCB Editor, designers zoom in and out or pan in the design canvas to take a closer look at a component’s placement and connectivity. Because they frequently zoom or pan when creating or edi...
    • 15 Nov 2021
  • Breakfast Bytes: Cadence and Intel Demonstrate CXL 1.1/2.0 Interoperability

    Paul McLellan
    Paul McLellan
    This weekend, timed to coincide with SC21, Cadence and Intel published a white paper on CXL interoperability (interop) testing titled Interop Shift Left: Using Pre-Silicon Simulation for Emerging Standards. The SC in SC21 stands for SuperComputing, ...
    • 15 Nov 2021
  • PCB、IC封装:设计与仿真分析: 详解有限元模型在系统分析中的应用

    SDA China
    SDA China
    本文要点: 有限元分析是在复杂几何中为微分方程求解的一种基本的数值计算方法。 这些复杂的系统可能无法人工求解,而且可能存在不同物理现象之间的耦合,特别是在电子领域。 顶尖的有限元系统将直接从 PCB Layout 中获取数据,并使用标准的数值算法创建多物理场仿真。 space 微分方程是用来描述物理现象的主要数学工具。从牛顿定律到薛定谔方程,任何物理系统都有一个可控制其行为的微分方程。常微分方程和偏微分方程求解是应用数学研究的一个长期课题,为此已开发出许多计算软件。 高度精确的数值计算方法可...
    • 13 Nov 2021
  • Computational Fluid Dynamics: This Week in CFD

    John Chawner
    John Chawner
    As we stand on the precipice of another weekend (the weekend just means there are still two more days to work), we can take stock of recent happenings in the world of CFD. What does this week's roundup include? Coffee and espresso. Formula-1, el...
    • 12 Nov 2021
  • Breakfast Bytes: Datapath Formal Verification 101: Technology and Technique

    Paul McLellan
    Paul McLellan
    Earlier this week, Cadence announced the Jasper C2RTL App, which I covered in my post Announcing Jasper C2RTL App: Formal for Algorithmic Designs. At the Jasper User Group, Disha Puri presented Datapath Formal Verification 101: Technology + Tech...
    • 12 Nov 2021
  • System, PCB, & Package Design : BoardSurfers: How to Map CAD Models in 3D Canvas

    Siddharth Makkar
    Siddharth Makkar
    In the world of PCB design, shorter delivery deadlines have less scope of re-spin cycles. Before manufacturing the board, every designer wants to see what the manufactured board would look like. Allegro 3D Canvas, enabled within Allegro® PCB Edi...
    • 12 Nov 2021
  • Analog/Custom Design: Virtuosity: Virtuoso Design Intent Notes Now Speak Many Languages

    Mate Zamori
    Mate Zamori
    Starting with ICADVM20.1 ISR20, you can write Design Intent notes in languages that use non-Latin character sets, for example, Mandarin Chinese, Japanese, and Hindi.
    • 11 Nov 2021
  • Breakfast Bytes: Happy 10th Birthday ISO 26262

    Paul McLellan
    Paul McLellan
    Today is the 10th anniversary of ISO 26262. It was first published on 11th November 2011. ISO 26262, titled Road vehicles – Functional safety is...err...about the functional safety of road vehicles. Cadence recently announced our own ...
    • 11 Nov 2021
  • Breakfast Bytes: Announcing Jasper C2RTL App: Formal for Algorithmic Designs

    Paul McLellan
    Paul McLellan
    Today is the first day of the Jasper User Group (unofficially known as JUG to attendees). All being well, Ziyad should be on stage (well, on the video stream) opening the meeting and he will introduce the Jasper C2RTL App. You can read my preview of ...
    • 10 Nov 2021
  • 定制IC芯片设计 : Virtuoso Meets Maxwell: 标准库组件的定义

    Tyler
    Tyler
    The Allegro Package Designer 产品线提供IC 封装从创意到生产所需的一切,它可以从Virtuoso环境通过Virtuoso MultiTech Framework调用。
    • 10 Nov 2021
  • PCB設計/ICパッケージ設計: BoardSurfers: Allegro PCB Editorを17.4-2019 Hotfix 019以上にバージョンアップするべき理由とは

    SPB Japan
    SPB Japan
    Cadence OrCAD and Allegro 17.4-2019 Hotfix 019(17.4-QIR3)は7月中旬にリリースされました。、現在は更に新しいHotfixがダウンロード可能です。今回のアップデートでは、複数の技術分野にわたり、多くの新機能や強化機能、お客様から報告されたバグの修正、パフォーマンスの向上を実現しています。ここでは、Allegro® PCB Editorでの追加、改善、修正内容をご紹介します。 NVIDIA GPUのサポートによるグラフィックの改善 GP...
    • 10 Nov 2021
  • Breakfast Bytes: Last-Mover Advantage

    Paul McLellan
    Paul McLellan
    I was reminded recently of a video/transcript that I remember coming across when it was fresh, five or six years ago. This was one lecture at Sam Altman's Stanford Startup Class where Peter Thiel was the guest lecturer. His central thesis was tha...
    • 9 Nov 2021
  • System, PCB, & Package Design : System Analysis Knowledge Bytes: Sigrity X the Next-Generation Signal and Power Integrity Solution

    deeptik
    deeptik
    Explore how Sigrity X, the next-generation signal and power integrity (SI/PI) solution, can help you solve system-level analysis problems with unprecedented speed and accuracy.
    • 8 Nov 2021
  • Digital Design: Voltus Voice: Hierarchical Power Integrity Analysis—Everything You Need to Know About PI Analysis

    sharvey
    sharvey
    In part 2 of our "Hierarchical Power Integrity Analysis" blog series, we discuss how to implement the hierarchical power integrity solution to create xPGV models of the IP blocks.
    • 8 Nov 2021
  • Breakfast Bytes: Reality in Your Glasses

    Paul McLellan
    Paul McLellan
    Despite all the recent noise about the Metaverse (and Facebook changing its company name to Meta), I remain convinced that augmented reality (AR) is going to be more important than virtual reality (VR), at least in the medium term. For one thing, vir...
    • 8 Nov 2021
  • 中文技术专区: 持续推进摩尔时代的IC设计艺术

    FormerMember
    FormerMember
    2021 年 11 月 3 日,由 ASPENCORE 主办的“2021 全球高科技领袖论坛 - 全球 CEO 峰会&全球分销与供应链领袖峰会”于深圳举行。Cadence 公司全球副总裁、亚太及日本总裁石丰瑜(Michael Shih)先生受邀在本次峰会上为我们带来了题为《持续推进摩尔时代的 IC 设计艺术》的重磅演讲。在演讲中 Michael Shih 先生与我们分享了在摩尔时代不断变化的背景下,IC 设计面临的机遇和挑战。 改变世界的摩尔定律 Michael...
    • 8 Nov 2021
  • The India Circuit: Mentor Story: Rajesh Swami Narayanan - Cadence Scholarship Program

    Asim Khan
    Asim Khan
    The Cadence Scholarship Program is the flagship CSR program of Cadence India, introduced five years ago. Many meritorious students from under-served sections of society drop out of the education system after school because of the lack of finances. Th...
    • 7 Nov 2021
  • PCB、IC封装:设计与仿真分析: 计算航空航天和计算流体力学的发展与未来

    SDA China
    SDA China
    本文翻译自Cadence “Computational Fluid Dynamics”专栏作者文章“ The Evolution of Computational Aerospace and CFD"。 space 故事的开端是“翼型”。具体来说,1968 年,有一点变得显而易见:人们需要使用新的工具来设计重中之重的翼型和机翼。今天,要想通过仿真获取飞机认证,以及保持每架飞机和飞机部件(即“数字孪生”)...
    • 7 Nov 2021
  • PCB解析/ICパッケージ解析: Sigrity / Systems Analysis 2021.1 HF3リリース(2021年9月) - 新機能ハイライト

    SPB Japan
    SPB Japan
    Sigrity & Systems Analysis (SIGRITY/SYSANLS) 2021.1 HF3リリースが Cadence Downloads サイトからダウンロード可能となりました。2021.1 HF3リリースで改修された項目は、インストールフォルダに含まれているREADME.txtをご参照ください。   SIGRITY/SYSANLS 2021.1 HF3 SIGRITY/SYSANLS 2021.1 HF3リリースの主要なアップデート内容をいくつかリストし...
    • 7 Nov 2021
  • PCB解析/ICパッケージ解析: System Analysis Knowledge Bytes: Clarity 3D Workbenchとは?

    SPB Japan
    SPB Japan
    System Analysis Knowledge Bytesブログシリーズでは、Cadence®が提供するシステム解析ツールの機能と可能性について説明しています。 このシリーズは、この分野での役立つ機能等に関する学識を提供することに加えて、システム解析に関連する知識と経験を共有するブロガーと専門家の意見を放送することを目的としています。   電気CADエンジニアは、自動車やIoTなどの業界向けの製品を設計します。そのタスクには、ICパッケージとプリント基板(PCB)との接合、...
    • 7 Nov 2021
  • Breakfast Bytes: Sunday Brunch Video for 7th November 2021

    Paul McLellan
    Paul McLellan
    https://youtu.be/rfVN6CA6LjQ Made in Pacifica (camera Carey Guo) Monday: Designing Planet-Scale Video Chips on Google Cloud Tuesday: Jasper User Group Preview Wednesday: Palladium Z2 Wins an ACE Award Thursday: Semiconductor Numbers Everyone Should K...
    • 7 Nov 2021
  • Breakfast Bytes: IEDM Preview 2021

    Paul McLellan
    Paul McLellan
    The big event for semiconductor process news is IEDM, the International Electron Devices Meeting. This year it will take place from December 11 to 15 at its usual location, the San Francisco Hilton Hotel as an in-person event. Then on-demand access t...
    • 5 Nov 2021
  • Breakfast Bytes: Semiconductor Numbers Everyone Should Know

    Paul McLellan
    Paul McLellan
    I wrote a post a couple of years ago Numbers Everyone Should Know. It was about timing of things in microprocessor-based systems, in particular the huge disparity between the cycle-time of a modern processor and the time required to access DRAM, let ...
    • 4 Nov 2021
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