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Visit us at DesignCon 2026, February 24-26, at booth 827, to discover Clarity 3D Solver's automated channel extraction (ACE) technology, a transformative tool designed to eliminate manual bottlenecks to simulating massive multi-channel systems. You will see how the ACE feature provides a scalable, automated path to high-fidelity 3D electromagnetic (EM) analysis, ensuring your designs meet performance targets faster…

In the fast-paced world of digital design, every engineer knows the truth: tapeout waits for no one. Whether you're wrestling with MMMC constraints, trying to decode datapath optimization, or figuring out why floorplan edits behave like mischievous gremlins, you might not have the luxury to sit through long courses when deadlines loom.

If you've ever stared at a timing violation, wondering whether your constraints…

Are you looking for a single integrated platform that runs both synthesis and implementation of your IC? Or if you are looking for fast and efficient design closure across a wide range of process nodes?

"No worries, the Innovus+ platform incorporates Innovus synthesis and Innovus implementation capabilities, all integrated into one unified environment for outstanding ease of use and power, performance, and area…

In the competitive semiconductor industry, leading innovators consistently set the bar with high-performance and power-hungry silicon. Their latest multi-billion-gate designs exposed the practical limitations of traditional pre-silicon power estimation methods—which were slow, unscalable, and posed risks to fully optimized power and performance for next-generation AI silicon.

A major semiconductor customer used…

As we step into 2026, it's a great time to reflect on the most popular blogs and videos from the past year, and to review key developments in education throughout 2025.  

In 2025, we published 9 of fresh Training Blogs each unlocking secrets of System Design and Verification.

We’d like to express our sincere appreciation to all our colleagues who consistently contribute insightful and engaging content—sharing valuable teaching…

Jakob Engblom from Cadence will be presenting a keynote at the RAPIDO (Rapid Simulation and Performance Evaluation for Design) workshop at the HiPEAC 2026 conference. The keynote title is "Virtual Platforms for System Architecture, Development, and Test" and it will draw on his long experience with virtual platforms in automotive and embedded.

Virtual platforms, virtual prototypes, and adjacent simulation solutions…

Understanding how PSS defines numeric expressions—and how Perspec supports these rules is important when writing constraints that involve mixed types, limited bit widths, or signedness to make sure you get exactly what you meant and might save you debugging time.

The definition of numeric expression semantics is in the PSS 3.0 LRM, sections 8.7 (Expression Evaluation) and 8.8 (Type Conversion Rules). These rules…

Today's multi-chip and chiplet solutions are leading the way for the "More than Moore" vision, with companies leveraging packaging technologies to create value and differentiation from their competitors. Silicon via (TSV), wafer-level packaging (WLP), and 3D stacking technologies are providing a tremendous number of packaging options for all form factors. The figure below provides a common example of 3D die/wafer stacking…